ASTM美国铜合金标准牌号

APPLICATIONDATASHEETStandardDesignationForC10100C12099-WROUGHTALLOYSCoppersLastUpdate:July20,2012Composition,percentmaximum,unlessshownasarangeoraminimumAlloysmarkedwith*areregisteredwiththeU.S.EPAasAntimicrobial.CopperNo.DesignationDescriptionCu(inclAg)Ag(%)MinAg(Troyoz)MinAsSbPTeOtherNamedElementsInactiveDateStatus*C10100OFEOxygen-Free-Electronic99.99min----.0005.0004.0003.0002.0005OxygenActive(1)(3)(2)*C10200OFOxygen-Free99.95min------------.0010OxygenActive(1)*C10300OFXLPOxygen-FreeCopper99.95min--------.001-.005----Active(4)*C10400OFSOxygen-FreewithAg99.95min.0278--------.0010OxygenActive(1)*C10500OFSOxygen-FreewithAg99.95min.03410--------.0010OxygenActive(1)*C10700OFSOxygen-FreewithAg99.95min.08525--------.0010OxygenActive(1)*C10800OFLP--99.95min--------.005-.012----Active(4)C10900--Ogygen-Free99.99min------------.001BiInactive03/10/2011*C10910----99.95min------------.005OxygenActive(1)*C10920----99.90min------------.02OxygenActive*C10930----99.90min.04413--------.02OxygenActive*C10940----99.90min.08525--------.02OxygenActive*C11000ETPElectrolyticToughPitch99.90min------------(5)Active(1)*C11010RHCRemeltedHighConducivity99.90min------------(5)Active(1)*C11020FRHCFire-RefinedHighConductivity99.90min------------(5)Active(1)*C11030CRTPChemicallyRefinedToughPitch99.90min------------(5)Active(1)*C11040----99.90min----.0005.0004--.0002(6)Active(1)*C11045ETPETP99.90min----.0005.0004--.0002(7)Active*C11100ETPElectronicToughPitch,Anneal99.90min------------(8)Active(1)Page1of2Composition,percentmaximum,unlessshownasarangeoraminimumAlloysmarkedwith*areregisteredwiththeU.S.EPAasAntimicrobial.CopperNo.DesignationDescriptionCu(inclAg)Ag(%)MinAg(Troyoz)MinAsSbPTeOtherNamedElementsInactiveDateStatusResistant*C11300STPToughPitchwithAg99.90min.0278--------(5)Active(1)*C11400STPToughPitchwithAg99.90min.03410--------(5)Active(1)*C11500STPToughPitchwithAg99.90min.05416--------(5)Active(1)*C11600STPToughPitchwithAg99.90min.08525--------(5)Active(1)*C11700----99.9min--------.04--.004-.02BActive(9)C11900--CopperAlloy99.93min--------.002-.010----Inactive02/01/1973C11904--CopperAlloy99.90min.0278----------Inactive03/09/1992C11905--CopperAlloy99.90min.03410----------Inactive03/09/1992C11907--CopperAlloy99.90min.08525----------Inactive03/09/1992*C12000DLPPhosphorus-Deoxidized,LowResidualP99.90min--------.004-.012----Active(1)Thisisahighconductivitycopperwhichhas,intheannealedconditionaminimumconcuctivityof100%IACSexceptforAlloyC10100whichhasaminimumconductivityof101%IACS.:(2)Thefollowingadditionalimpuritymaximumlimitsshallapply:Bi,1ppm(.0001%);Cd,1ppm(.0001%);Fe,10ppm(.0010%);Pb,5ppm(.0005%);Mn,0.5ppm(.00005%);Ni,10ppm(.0010%);Se,3ppm(.0003%);Ag,25ppm(.0025%);S,15ppm(.0015%);Sn,2ppm(.0002%);Zn,1ppm(.0001%).:(3)Cuisdeterminedbythedifferencebetweentheimpuritytotaland100%.TheCuvalueisexclusiveofAg.:(4)IncludesP.:(5)Oxygenandtraceelementsmayvarydependingontheprocess.:(6)Thefollowingadditionalmaximumlimitsshallapply:Se,2ppm(.0002%);Bi,1.0ppm(.00010%);GroupTotal,Te+Se+Bi,3ppm(.0003%).Sn,5ppm(.0005%);Pb,5ppm(.0005%);Fe,10ppm(.0010%);Ni,10ppm(.0010%),S,15ppm(.0015%);Ag,25ppm(.0025%);Oxygen,100-650ppm(.010-.065%).Thetotalmaximumallowableof65ppm(.0065%)doesnotincludeoxygen.:(7)Thesetotalmaximumlimitsshallapply;Se2ppm(.0002%);Bi.5ppm(.00005%);Sn5ppm(.0005%);Pb5ppm(.0005%);Fe10ppm(.0010%);Ni10ppm(.0010%);S15ppm(.0015%);Ag25ppm(.0025%);Oxygen125-600ppm.:(8)SmallamountsofCdorotherelementsmaybeaddedbyagreementtoimprovetheresistancetosofteningatelevatedtemperatures.:(9)IncludesB+P.:Page2of2APPLICATIONDATASHEETStandardDesignationForC12100C14199-WROUGHTALLOYSCoppersLastUpdate:November15,2012Composition,percentmaximum,unlessshownasarangeoraminimumAlloysmarkedwith*areregisteredwiththeU.S.EPAasAntimicrobial.CopperNo.DesignationDescriptionCu(inclAg)Ag(%)MinAg(Troyoz)MinAsSbPTeOtherNamedElementsInactiveDateStatus*C12100DLPSPhosphorus-Deoxidized,LowResidualP99.90min.0144----.005-.012----Active*C12200DHPPhosphorus-Deoxidized,HighResidualP99.9min--------.015-.040----Active(1)*C12210----99.90min--------.015-.025----Active*C12220----99.9min--------.040-.065----Active*C12300DHPSPhosphorus-Deoxidized,HighResidualP99.90min.0144----.015-.040----Active*C12500FRTPFire-RefinedToughPitch99.88min----.012.003--.025.003BiActive(2).004Pb.050Ni*C12510----99.9min------.003.03.025.005BiActive(2).05Fe.020Pb.050Ni.05Sn.080Zn*C12700--CopperAlloy99.88min.0278.012.003--.025.003BiInactive03/09/1992(2).004Pb.050Ni*C12800--CopperAlloy99.76min.03410.012.003--.025.003BiInactive03/09/1992(2).004Pb.050Ni*C12900FRSTPFire-RefinedToughPitchwithAg99.88min.05416.012.003--.025.003BiActive(3).004PbPage1of2Composition,percentmaximum,unlessshownasarangeoraminimumAlloysmarkedwith*areregisteredwiththeU.S.EPAasAntimicrobial.CopperNo.DesignationDescriptionCu(inclAg)Ag(%)MinAg(Troyoz)MinAsSbPTeOtherNamedElementsInactiveDateStatus.050NiC13000--CopperAlloy99.88min.08525.012.003--.025.003BiInactive03/09/1992(2).004Pb.05Ni*C13100----99.8min--------------Active*C13150--Copper99.5min--------------Activ