电子信息工程毕业论文

xxxx大学毕业论文论文题目：车载可测温式电子万年历学生姓名：xx指导教师：xxx所学专业：电子信息工程2009年6月ChengdongCollegeofNortheastAgriculturalUniversityThesisThesistopic：TheVehicleCarriesTemperatureMeasurementTypeElectronTenThousandCalendarsStudentname：Tutorname：Specialty：ElectronicAndInformationEngineeringJune2009车载可测温式电子万年历－I－车载可测温式电子万年历摘要随着电子技术的迅速发展，特别是随着大规模集成电路的出现，给人类生活带来了根本性的改变。尤其是单片机技术的应用产品已经走进了千家万户，如电子万年历的出现给人们的生活带来了诸多方便。本文描述了系统硬件工作原理，并附以系统结构框图加以说明，着重介绍了本系统所应用的各硬件及其接口技术和各硬件模块的功能及工作过程；其次，详细阐述了程序的各个模块和实现过程。本设计以数字集成电路技术为基础，单片机技术为核心。编写的主导思想软硬件相结合，以硬件为基础，来进行各功能模块的编写。本系统为了便于扩展和更改，软件的设计采用模块化结构，使程序设计的逻辑关系更加简洁明了。系统通过传感器采集温度。用四个数码管显示数据，可以显示时间和温度，也可以通过按键调整时间。关键词：电子万年历；单片机；时钟芯片；温度传感器；数码管显示车载可测温式电子万年历－II－TheVehicleCarriesTemperatureMeasurementTypeElectronTenThousandCalendarsAbstractAlongwithelectronictechnology'srapidlyexpand,speciallyalongwithlargescaleintegratedcircuit'sappearance,livedforthehumanityhasbroughtthefundamentalchange.Especiallythemonolithicintegratedcircuittechnology'sapplicationproductalreadyenteredeveryone,iftheelectronictenthousandcalendar'sappearanceshavebroughtconvenientlymanyforpeople'slife.Thisarticledescribedthesystemhardwareprincipleofwork,andattachesbythesystemstructurediagramexplainedthatintroducedemphaticallythissystemappliesvarioushardwareandconnectiontechnologyandvarioushardwaremodulefunctionandworkprocess;Next,elaboratedindetailprocedureeachmoduleandrealizestheprocess.Thisdesigntakethedigitalintegratedcircuittechnologyasthefoundation,themonolithicintegratedcircuittechnologyisacore.Thecompilationguidingideologysoftwareandhardwareunifies,takethehardwareasthefoundation,carriesonvariousfunctionalmodulethecompilation.Thissystemforeaseoftheexpansionandthechange,software'sdesignusesthemodularstructure,causestheprogrammingthelogicalrelationevenmoresimpleandbrief.Systemthroughtwogroupofnixietubedemonstrationdata.Maythetelltimeandtheweek,afterpressingdowncutsthekey,maytheshowdate.Keyword：Electronictenthousandcalendars;Monolithicintegratedcircuit;Clockchip;Temperaturesensor；Nixietubedemonstration车载可测温式电子万年历－III－目录摘要.........................................................................................................................................IAbstract.....................................................................................................................................II前言......................................................................................................................................１1方案选择..............................................................................................................................２1.1整机设计方案选择...................................................................................................２1.2单片机芯片的选择...................................................................................................２1.3时钟芯片的选择.......................................................................................................２1.4温度传感器的选择...................................................................................................３2硬件设计..............................................................................................................................４2.1电路组成框图...........................................................................................................４2.2系统硬件概述及整机工作原理...............................................................................４2.3各芯片介绍...............................................................................................................６2.3.1AT89S51单片机.............................................................................................６2.3.2DS12887时钟芯片.........................................................................................８2.3.2.1DS12887主要功能简介......................................................................９2.3.2.2DS12887引脚说明..............................................................................９2.3.2.3时间，日历和定闹单元.................................................................１０2.3.2.4DS12887的控制寄存器..................................................................１１2.3.3DS18B20温度传感器................................................................................１２2.4数码管显示电路设计...........................................................................................１３2.4.1显示模块的选择与方案论证....................................................................１３2.4.2LED显示器工作原理................................................................................１３3系统软件设计..................................................................................................................１５3.1系统功能模块及主程序流程图...........................................................................１５3.2DS12887初始化程序设计.................................................................................１６3.3显示子程序设计...................................................................................................１６3.4时间调整程序设计...............................................................................................１７3.5温度采集程序设计.........