绿色电子产品和无铅制造绪论(1)

12z“”23zzz…41zzzz352zz“”“”501001400z...6¾¾¾¾¾¾¾¾¾¾¾¾¾¾472003127RoHSWEEERoHS:RestrictionofHazardousSubstancesWEEE:WasteElectricandElectronicEquipment2004727RoHSWEEE2005813WEEE()200671RoHS20061231WEEE859RoHSHOMOGENEOUSMATERIALS‹Lead(Pb)0.1%byweight‹HexavalentChromium(Cr6+)0.1%byweight‹Mercury(Hg)0.1%byweight‹PBB,PBDE0.1%byweight‹Cadmium(Cd)0.01%byweight10HOMOGENEOUSMATERIALSCablesPlasticcoverCoppercorePlatinglayerBasecopper123611WEEE123IT342006RecoveryRate)75%(RecycleRate)65%45612123IT45678910RoHSWEEE713RohsWEEEWEEERohs14EU153.7AustriaGreeceBelgium*LuxembourgDenmarkTheNetherlandsFinlandPortugalFrance*SpainGermany*SwedenIrelandUnitedKingdomItaly*20041213,10EU200451EUCzechRepublic,Cyprus,Estonia,Hungary,Lithuania,Malta,Poland,Slovenia,SlovakRepublic,LatviaEU815EUEEE(ElectricalandElectronicEquipment)EU20026203602602001450….16Rohs/WEEEz200422420043052006711917RoHS/WEEEzRoHSzRoHS,¾¾¾¾18RoHSzRohszzzzzzzISOz1019RoHSISO-3856-4:1984ISO-11885:1986EN1122:2001///CdISO-11885:1986ENISO-5861:1995EN13346:2000EPA3052:1996PbZV0-0101-UV-05ISO3613:2000Cr6+EN12238EN13348EPA3052:1996////HgPBBPBDE20RoHS(GC/MS)(FT-IR)PBB,PBDECr6+(UV/VS)Cr6+ICPS,AASX(EDX)Pb,Cd,Hg1121:0122ROHS/WEEEFAQ:„Rohs/WEEE?„ROHSWEEE?„ROHSWEEEPb1223„Rohs??„WEEE?„ROHS/WEEE,?ROHS/WEEEFAQ:24Rohs/WEEE¾¾¾¾¾¾¾¾¾¾DesignforEnvironment1325:„„„„26:„„„„„„1427:„„„„„„„„„„28:„„„¾¾1529RohszEURoHS20031272006715zHomeElectronicsRecycleLaw20014zEPAToxicsReleaseInventory200111000.10.12.530z0.1%(1000ppm)zPbRoHSzForthepurposesoftheEURoHS,aMCVofuptothefollowingvaluesin‘HOMOGENEOUSMATERIALS’forPb,……willbepermittedinthemanufactureofnewEEE(electricalandelectronicequipment)zLead(Pb)0.1%byweight1631Pb0.1a.b.c.d.PbPb/1000.1%32zLeadinsoldersforservers,storageandstoragearraysystems(exemptiongranteduntil2010).zLeadinsoldersfornetworkinfrastructureequipmentforswitching,signaling,transmissionaswellasnetworkmanagementfortelecommunication.zLeadinelectronicceramicparts(e.g.,piezoelectronicdevices).zLeadinhighmeltingtemperaturetypesolders(i.e.,SnPbsolderalloyscontaining85wt%Pb).zLeadinglassofcathoderaytubes,electroniccomponentsandfluorescenttubes.zLeadasanalloyingelementinsteelcontainingupto0.35wt%Pb,aluminumcontainingupto0.4wt%Pbandascopperalloycontainingupto4wtPb.RoHS2003.2.13Pb,Control,MedicalProducts34(1)(2)(3)•••••¾¾¾1835(%)z80.81z4.78()z4.69z1.79z1.40z1.13z0.72z0.72z()0.70z0.49z2.77z:AdvancingMicroelectronics,September/0ctober1999.(Totalexempted93%)50036TAC.EUTAC(TechnicalAdaptationCommittee)TACTACEUCommissioner.TACTAC15theTAC.TACTACvotingpower.GermanyandUnitedKingdomEU1937RohsWEEERohs“”¾*ImpactsofLead-FreeSolderingonMaterials¾*ImpactsofLead-FreeSolderingonProcess¾*ImpactsofLead-FreeSolderingonPCBs¾*ImpactsofLead-FreeSolderingonComponents¾*ImpactsofLead-FreeSolderingonDesigns¾*ImpactsofLead-FreeSolderingonSolderJoints¾*ImpactsofLead-FreeSolderingonReliability“”38zRoHS-EURestrictiononHazardousSubstancesz://www.nemi.orgzHDPUG-HighDensityPackageUsersGroupz://www.jedec.orgzIPC-AssociationConnectingElectronicsIndustriesz://www.jeita.orgzz….