Template+of+EQ

TemplateofEngineeringQueryI.Documentitems1.Netlistfile2.Can’topenfile3.Missingfile4.Whatthefilesareusedfor?5.Rev.6.Whichspecwillbeused?7.Onefilm,butdifferentrequirementinanotherplaceII.Cost&specialMaterial1.laminatematerial2.laminatecoreforsinglesideboard3.Soldermaskinkmaterial4.OtherspecialmaterialIII.BoardThk&Tol1.NospecifiedBoardThk2.UnclearmeaningonboardThk3.Lay-uporder4.Lay-upstructureIV.Drilllayer&hole1.Holetype2.Mismatchedholechartinformation3.Specialholewithstrangeconductorpad4.HoleDiameterTol5.Pressfithole6.Overlappedhole7.Tooclosebetweenholetoboardedge8.Holequantity9.HolelocationTol10.PositionofstampholeV.Drawing,dimension&Tolerance1.Outlinetolerance2.Mismatcheddimensions3.Missingdimensions4.Innercornersize5.AsymmetryTol6.Dataofholetoedge7.Quality&sideforFiducialmark?8.DirectiontoarrangeunitinarrayDWGVI.Impedanceitems1.Whichkindofline?2.Impedancevalue3.Couponlinewidth4.Distancebetweenholesincoupon5.TestpointissueVII.CuThk1.PTHhole2.Buriedhole&blindhole3.SurfacecopperThkVIII.Conductordesign1.Deletenon-functionalisolatedpadsininnerlayer2.Annularring3.Clearanceissue4.Isolatedlinetoseparatedifferentareaininnerlayers5.Tentingholeissue6.Linewidth/spacingTol7.Strangedesign8.Exposedcopperalongboardedge9.PlatingGoldfingerguideline10.Isolatedfiducialmark11.Dummypatternatbreakawayarea12.Dummypatternatblankareainboard13.Fillinthenarrowspacing14.Similarissueon“MadeinUSA”15.LOGOposition&typeIVIII.Soldermask&Legendfilm&other(Carbonink&peelablemask)1.SoldermaskThk2.Pluggedholeitems3.Soldermaskbridge4.Exposedline/pad5.SoldermaskbridgebetweenGoldFinger6.DistancebetweentheS/Mopeningedgeofviahole/padandS/MopeningofthetopofGoldFinger7.ExtraS/Mopening8.MissingS/MopeningforSMTpad/roundpad9.Componentmarkbridge10.C/Mwidth11.Reverselegend12.LOGOincreasecostIX.Surfacefinal1.Nocallsurfacetreatment2.Rohsrequirement3.TighterThk4.FeasibilityofprocessXI.Fabricationforprofile1.RoutorPunch2.V-cut3.G/Fbevel4.ChamferXII.Bow&TwistXIII.X-outCommonQueryForYourReferenceI.Documentitems1.NetlistfileQuestion1:AftercomparingthecustomernetlistfilewithCADfilminputtedbyourCAD/CAM.Someshort/openwasfound.seefigxx.Suggestion:a)IngorethenetlistfileandjustfollowtheCADdatatodo.b)PleaseresendtherightGerberfiletous.2.Can’topenfileQuestion2:Wecan’topenthefileinthepackage(seefigxx).Suggestion:a)Ingoreit.b)Pleaseresendittouswithotherformat.3.MissingfileQuestion3:MissingfilescalledintheGerberfile(seefigxx).Suggestion:a)Ingorethem.b)PleasesendthemtousASAP.4.Whatthefilesareusedfor?Question4:wedon’tknowwhatthefilescalledinpackageusedfor?(seefigxx).Suggestion:a)Ingorethem.b)Pleaseadvise.5.Rev.Question5:TheRevofcustomerP/NisdifferentbetweenRevAinGerberfileandRevBinmailinformation?(seefigxx).Suggestion:a)FollowRevAinGerberfiletodo.b)Pleaseadvise.6.Whichspecwillbeused?Question6:Customerdon'tcallfabricationspecfortheproject.Suggestion:a)We’lluseIPC-A-600GClass2&IPC-6012Class2todo..b)Pleaseadvise.7.Onefilm,butdifferentrequirementinanotherplaceQuestion7:Customerrequiresprintsoldermaskonbothsides,butthereisTopsidesoldermaskfilmintheGerber..Suggestion:a)PleaseconfirmtheoneS/Mfilmwillbeappliedtobothsides.b)JustapplytoTopside.II.Cost&specialMaterial1.laminatematerialQuestion1:Customerrequirestousexxxlaminatecore,butwehavenothiskindofmaterialinstore,it’lltakelongtimetoorderthespecialmaterialandincreaseproductioncycle.Suggestion:Toshortenlead-time,weproposetousexxxlaminatecorefromxxxvendorinsteadofit.Question2:CustomerrequirestousexxxlaminatecorewithhighTg(=170degree),butwehavenothiskindofmaterialonhand,it’lltakelongtimetoorderthespecialmaterialandincreasehighcost.Suggestion:Toreducecostandshortenlead-time,weproposetousexxxlaminatecorewithnormalTg(nominal140degree)fromxxxvendorinsteadofit.2.laminatecoreforsinglesideboardQuestion3:CustomercallFR-4materialforthesingle-sideboard.Suggestion:Toreducecost,weproposetouseCEM-1/CEM-3insteadofit,pleaseconfirm.3.SoldermaskinkmaterialQuestion4:XXXsoldermaskinkisrequiredincustomerDWG,butwehavenothematerialinstock,andit’lltakelongtimetoorderitandincreasehighcost?Suggestion:a)Toreducecostandshortenlead-time,weproposetouseGreenxxxinkfromxxxvendorinsteadofit..b)Pleaseadvise.4.OtherspecialmaterialQuestion5:.Forotherspecialmaterial,refertoaboveEQtoinquirecustomertousecommoncheapmaterialinsteadofit.III.BoardThk&Tol1.NospecifiedBoardThkQuestion1:NotspecifiedboardThk&TolincustomerDWG&Spec..Suggestion:a)We’llbuildthefinishedboardThk&tolas1.6+/-0.16mm..b)Pleaseadvise.Question2:Thetoleranceofboardthk+/-xxxmiliscalledincustomerDWG/Spec,butit’sverytight.Ifmeetit,wehavetoorderspecialmaterialandincreasehighcost.Suggestion:a)Toreducecost,pleasekindlyrelaxitto+/-10%ofboardThk.b)Ifcustomerinsistonit,pleaseMKTreconsiderthecost.2.UnclearmeaningonboardThkQuestion3:Wecan’tknowwhethertheboardThicknessxxxmilcalledbycustomerisfinishedorexcludingsoldermask?.Suggestion:a)BoardThkXxxmilmeanstotalfinishedboardthk..b)ItjustmeansThkbeforeplating(orsuggestexcludingsoldermask).3.Lay-uporderQuestion4:Customerdoesn’tdefinethelay-uporder.Suggestion:a)We’llbuildboardper