JIS Z3198-5-2003 英文版 无铅焊剂的试验方法.第5部分焊缝的拉伸试验和剪切试验方法

ISJAPANESESTRIALSTANDARDTranslatedandPublishedbyJapaneseStandardsAssociationTestmethodsforlead-freesolders-Part5:MethodsfortensiletestsandsheartestsonsolderjointsICs25.160.50Referencenumber:JIS23198-5:2003(E)PROTECTEDBYCOPYRIGHT7sCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:28:29MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-52003ForewordThistranslationhasbeenmadebasedontheoriginalJapaneseIndustrialStandardestablishedbytheMinisterofEconomy,TradeandIndustrythroughdeliberationsattheJapaneseIndustrialStandardsCommitteeaccordingtotheproposalofestablishingaJapaneseIndustrialStandardfromTheJapanWeldingEngineeringSociety(JWES),withadraftofIndustrialStandardbasedontheprovisionofArticle12Clause1oftheIndustrialStandardizationLaw.SolderingiscalledHANDAZUKE(Japanese),atechniquetobeusedformountingelectronicandelectricalmachineryandapparatus,communicationequipmentandthelikeanditsusefieldiswideandexpectationforhighreliabilityoftheconnectionislarge.ThoughtherearestandardsinsideandoutsideJapanaswellasInternationalStandardslikeIECorISO,thisStandardusesresultsof“standardizationoftestmethodsandthelikenecessaryforsolderconnectioncorrespondingtothereductionofanenvironmentalload”basedontheresearchanddevelopmentbycontractofNewEnergyandIndustrialTechnologyDevelopmentOrganization.ThisStandardconcernsthemethodsfortensiletestsandsheartestsonsolderjointsoflead-freesolderswhichareenvironmentallyfriendlyandispositionedasastandardforconsideringenvironment.AttentionisdrawntothepossibilitythatsomepartsofthisStandardmayconflictwithapatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelaReropeningtothepublicwhichhavetechnicalproperties.TherelevantMinisterandtheJapaneseIndustrialStandardsCommitteearenotresponsibleforidentifyingthepatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavethesaidtechnicalproperties.JISZ3198includesthefollowing7partswiththegeneraltitleTestmethodsforlead-freesoldersPart1:MethodsformeasuringofmeltingtemperaturerangesPart2:Methodsfortestingofmechanicalcharacteristics-tensiletestPart3:MethodsforspreadtestPart4:MethodsforsolderabilitytestbyawettingbalancemethodandacontactanglePart5:MethodsfortensiletestsandsheartestsonsolderjointsPart6:Methodsfor45”pulltestofsolderjointsonQFPleadPart7:MethodsforshearstrengthofsolderjointsonchipcomponentsmethodDateofEstablishment:2003-06-20DateofPublicNoticeinOfficialGazette:2003-06-20Investigatedby:JapaneseIndustrialStandardsCommitteeStandardsBoardTechnicalCommitteeonWeldingJISZ3198-5:2003,FirstEnglisheditionpublishedin2003-12Translatedandpublishedby:JapaneseStandardsAssociation4-1-24,Akasaka,Minato-ku,Tokyo,107-8440JAPANIntheeventofanydoubtsarisingastothecontents,theoriginalJISistobethefinalauthority.O]SA2003Allrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromthepublisher.PrintedinJapanPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:28:29MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-5:2003ContentsPageIntroduction.................................................................................................................12344.14.255.15.25.36788.18.299.19.210Scope....................................................................................................................Normativereferences........................................................................................Definitions..........................................................................................................Testpiece............................................................................................................Classificationoftestpiece.............................................................................Shapeanddimensionsoftestpiece.............................................................Testmaterial,solder,fluxandsolderingatmosphere................................Testmaterial....................................................................................................Solder.................................................................................................................Fluxandsolderingatmosphere.....................................................................Solderingoftestmaterial................................................................................Heattreatmentoftestmaterial.....................................................................Testmethod............................................................