台湾芯片之王联发科的内部资料-手机Pcb设计建议_XXXX最新版

InternalUseCopyright©MediaTekInc.Allrightsreserved.MT6253PCB设计建议Version:1.0InternalUseCopyright©MediaTekInc.Allrightsreserved.2010/8/16CT/PCBInternalUseInnovationTechnologyProductGoodtoGreatOutline▪MT6253PCBFootprint设计建议▪PCBLayout建议(ForSMT)▪PCB制作工艺需求2010/8/16Copyright©MediaTekInc.Allrightsreserved.2InternalUseInnovationTechnologyProductGoodtoGreatMT6253PackageOutlineDrawing2010/8/16Copyright©MediaTekInc.Allrightsreserved.3附件为Pdf&dwg檔的格式InternalUseInnovationTechnologyProductGoodtoGreatMT6253PCBLandPatternDrawing2010/8/16Copyright©MediaTekInc.Allrightsreserved.4InternalUseInnovationTechnologyProductGoodtoGreatMT6253SolderMaskRecommendation2010/8/16Copyright©MediaTekInc.Allrightsreserved.5SolderMaskOpening(绿油开窗)PadsizeCenterPadMaskOpening绿油桥(SolderDam)InternalUseInnovationTechnologyProductGoodtoGreatMT6253StencilRecommendation2010/8/16Copyright©MediaTekInc.Allrightsreserved.6ItemValueMaterialStainlesssteelFabricationmethodLasercutThickness0.1mmGNDE-Pad鋼網(Stencil)製作建議(1)建议钢网开口边缘距离PCB焊盘边缘0.2mm以上.(2)钢网开口可视实际SMT需求微调.InternalUseInnovationTechnologyProductGoodtoGreatMT6253CompositePattern2010/8/16Copyright©MediaTekInc.Allrightsreserved.7InternalUseInnovationTechnologyProductGoodtoGreatOutline▪MT6253PCBFootprint设计建议▪PCBLayout建议(ForSMT)▪PCB制作工艺需求2010/8/16Copyright©MediaTekInc.Allrightsreserved.8InternalUseInnovationTechnologyProductGoodtoGreatPCBLayout基本规范▪Normaltrace/spacing:0.1/0.1mm(4/4mil)▪4LayerPCB–Viatype:•Blindvia(1-2,3-4)0.1/0.3mm(4/12mil)•Buriedvia(2-3)0.3/0.5mm(12/20mil)•Throughvia(1-4)0.3/0.5mm(12/20mil)–Layerdefinition:•Layer1:Component/Signal/GND(无走线区域请铺GNDplane)•Layer2:Signal/GND(无走线区域请铺GNDplane)•Layer3:Signal/GND(无走线区域请铺GNDplane)•Layer4:Component/Signal/GND(主要的GNDplane,请尽量避免走线)▪6LayerPCB–Viatype:•Blindvia(1-2,5-6)0.1/0.3mm(4/12mil)•Buriedvia(2-5)0.3/0.5mm(12/20mil)•Throughvia(1-6)0.3/0.5mm(12/20mil)–Layerdefinition:•Layer1:Component/Signal/GND(无走线区域请铺GNDplane)•Layer2:Signal/GND(无走线区域请铺GNDplane)•Layer3:GND(主要的GNDplane,请尽量避免走线)•Layer4:Signal/GND(无走线区域请铺GNDplane)•Layer5:Signal/GND(无走线区域请铺GNDplane)•Layer6:Component/Signal/GND(无走线区域请铺GNDplane)2010/8/16Copyright©MediaTekInc.Allrightsreserved.9InternalUseInnovationTechnologyProductGoodtoGreatRecommendationofBlindViaonPad2010/8/16Copyright©MediaTekInc.Allrightsreserved.10:traceinL2:Pad(表层焊盘):Via在焊盘正中央:Via不在焊盘中央GoodNG建议将blindvia下在pad正中央，可避免因pad变形所造成的SMT不良影响:BlindVia(激光盲孔)drill/Land=0.1mm/0.3mmNGInternalUseInnovationTechnologyProductGoodtoGreatIC下方避免Top层面铺铜2010/8/16Copyright©MediaTekInc.Allrightsreserved.11RecommendedDesignRFGnd区域，使用0.2mm(8mil)连接并下via1-2(盲孔)至内层GNDPlane即可在IC下方铺铜会造成padsize过大，容易发生连锡建议设计!NG!(强烈不建议!)InternalUseInnovationTechnologyProductGoodtoGreatFanout线宽建议▪Fanout最粗线宽建议0.2mm(8mil).2010/8/16Copyright©MediaTekInc.Allrightsreserved.12建议设计!RecommendedDesignNG(强烈不建议!)建议拉线至绿油开窗外后再加粗如果线宽≧Pad的size:0.27mm(10.6mil),将会导致Pad变形以及无法制作出阻焊环，并有可能的会造成SMT的不良影响.Pad变形无阻焊环InternalUseInnovationTechnologyProductGoodtoGreatOutline▪MT6253PCBFootprint设计建议▪PCBLayout建议(ForSMT)▪PCB制作工艺需求2010/8/16Copyright©MediaTekInc.Allrightsreserved.13InternalUseInnovationTechnologyProductGoodtoGreatI/OPadSize之设计规范2010/8/16Copyright©MediaTekInc.Allrightsreserved.140.27mm(10.6mil)+/-0.03mm(1.2mil)要求信号Padsize的直径是0.27mm(10.6mil)，和IC封装尺寸一样大（1：1），其公差必须控制在+/-0.03mm(1.2mil)以内.InternalUseInnovationTechnologyProductGoodtoGreatTheSolderMaskSizeofI/OPad之设计规范2010/8/16Copyright©MediaTekInc.Allrightsreserved.15•Pad一定要有阻焊环,而Pad与Pad之间必须也要有SolderDam.•绿油印刷不可覆盖到Pad.SolderDam≈0.1mm(3.8mil)min.≧0.075mm(3mil)SolderMaskOpening0.37mm(14.5mil)InternalUseInnovationTechnologyProductGoodtoGreatSummary▪PCBLayoutSuggestion–ForE-pad•建议与IC接地焊盘相同尺寸(即封装库1：1的面积比例)制作E-Pad–ForSignalPad•建议制作直径为0.27mm的圆形焊盘(按封装库1:1制作)，實際PCB成品精度需控制在+/-0.03mm•禁止在aQFNIC表层使用铺铜设计•为避免連錫的發生，RFGND间建议用8mil走線並打Blindvia连通到内层的GNDPlane•Pad与Pad之间必須留有阻焊桥3mil以上•I/OPad走線≦8mil•Blindvia必須打在Pad正中心▪StencilOpeningSuggestion(請參考P.5)–ForE-padarea•建议采用0.1mm厚的钢网，钢网开口佔總面積40%.•建议钢网开口边缘距离PCB焊盘边缘0.2mm以上.•钢网开口可视实际SMT需求微调–ForSignalPad•建议采用0.1mm厚的钢网，开口直径為0.27mm•建议将其开口外形制作成方形導R角(0.075mm)，並旋轉45°2010/8/16Copyright©MediaTekInc.Allrightsreserved.16