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MakeengineeringcapabilityassessmentchecklistandassessmentreportConfidentiality:INTERNAL得分Score得分说明ScoreExplainNA制程不涉及Theprocess/systemisinapplicability0未标准化没有相关文件指导Non-standardization1标准化现场操作有指导书指导StandardizationthereisSOPtoguidetheoperation2可视化现场操作可视化改进Visibilitythereisvisibilitytooltoguidetheoperationimprovement.3防错化工具、方法优化效率提升/防呆Foolproofthereisfoolprooftooltoguidetheefficiencyimprovement.4自动化信息、设备自动执行AutomationTheoperationisdoneautomatically.5趋零化业务/技术优化取消作业EliminationTheoperationiscanceledaccordingtotechnologyimprovement.DocumentCode:SUP_M_MEC_C100816V03.002020/2/21Conservedtimeoftherecord:permanentHuaweiProprietary-RestrictedDistributionPage1of23MakeengineeringcapabilityassessmentchecklistandassessmentreportConfidentiality:INTERNAL典型示例TypicalExample无操作指导文件或规范文件(需要规范情况下只有专用指导书不得分)。NoWIorregulation(needregulationonlyWI)现场操作指导书或规范文件、操作保养记录表(无checklist内容)。HasWIorregulation、maintenancerecords(nochecklist)指导书图片说明、点检checklist表、报警、颜色标识、箭头标识、状态标识、管控标签、量测工装工具。WIhaspictureinstruction、checklist、warning、colorlabel、arrowheadsymbol、statusmarker、labelcontrol、measuretools.有起到防呆作用的工装工具或方法,如IT扫描系统扫描比对、有异常自动中止运行,效率提升不考虑。Haspreventivetoolsormethod,suchasITsystemautomaticcomparethroughscanbarcode,automaticstopwhenexceptionhappen,efficiencyimprovementdon'tadopttemporarily.)如EC自动解析、自动打螺钉、自动点胶、自动加锡等(ECautomaticparsing、automaticscrew、automaticgluedispensing、automaticweldingetc.)如针对手工焊相关内容,实现完全取消手工焊。Cancelmanualoperatingabouthandsolderingoperationcompletely.DocumentCode:SUP_M_MEC_C100816V03.002020/2/21Conservedtimeoftherecord:permanentHuaweiProprietary-RestrictedDistributionPage2of23MakeengineeringcapabilityassessmentchecklistandassessmentreportConfidentiality:INTERNAL稽核明细AuditDetails日期Date:ScoringSummaryNo工序Procedure分数Score备注Remarks1印刷PastePrinting#DIV/0!适用单板环节PCBA2贴片ComponentPlacement0%适用单板环节PCBA3回流ReflowSoldering0%适用单板环节PCBA4检测Inspection0%适用单板环节PCBA5补焊Manualsoldering#DIV/0!适用单板环节PCBA6单板装配Boardassembly#DIV/0!适用单板环节PCBA7返修Rework0%适用单板环节PCBA#DIV/0!#DIV/0!改进区AreaofImprovementsMandatoryCommonNo工序Procedure问题类别Category改善对策CorrectiveAction完成日期DueDate状态Status结果OverallResults:工程能力评估总结ProcessAuditResults稽核组人员AuditTeamMember:平均分数OverallAverage发现问题FindingsPreparedBy:ReviewedBy:ApprovedBy:印刷PastePrinting贴片Component…回流ReflowSoldering检测Inspection补焊Manualsoldering单板装配Board…返修ReworkDocumentCode:SUP_M_MEC_C100816V03.002020/2/21Conservedtimeoftherecord:permanentHuaweiProprietary-RestrictedDistributionPage3of23MakeengineeringcapabilityassessmentchecklistandassessmentreportConfidentiality:INTERNAL6090满分60%80%100%60%80%100%60%80%100%60%80%100%60%80%100%60%80%100%60%80%100%DocumentCode:SUP_M_MEC_C100816V03.002020/2/21Conservedtimeoftherecord:permanentHuaweiProprietary-RestrictedDistributionPage4of23MakeengineeringcapabilityassessmentchecklistandassessmentreportConfidentiality:INTERNALNoClassChecklistCommentsmaximumscoreActualscore(NA-0-1-2-3-4-5)实际情况(是否有指导文件或标准或标准可视化或防呆措施等)1产品信息是否有标准明确的输入来源Isproductinformationdefinedinputsources.环保属性、CAD文件(单板长宽厚、MARK点坐标、封装信息),从什么渠道获取。Keymessage:ROHS、CADfile(boardsize/markpointcoordinate/packinginformation)2有明确规定生产使用的刮刀的型号和技术规格。Isthereclearlydefinedthescrapertechnicalspecifications.设备认证需求是否有明确的刮刀规格和技术认证checklist,包括材质、角度、硬度、表面光洁度。Spec:materialquality,angle,hardness,surfacefinishment.3如何保证不同尺寸单板或者设备选择的刮刀长度是合适的刮刀选用规格Howtoensurethatthescraperspecificationsissuitable.不同的开口范围刮刀选择不一样不同设备的刮刀选择Scraperselectaccordingopenscope,equipment'stype.4是否有印刷参数设置规范Istherespecificationtosetprintingparameters刮刀长度、印刷速度、有指导书做成解析文件。WIprintingparameterincludescraperlength,printingspeedetc.5如何保证制定的印刷参数是符合工艺规范Howtoensurethattheprintingparametersmeettothetechnicalspecifications设置印刷参数时有没有产品封装信息识别、钢网设计信息识别。Identifypackageinformationandstencilinformationwhensettingtheprintingparameters.6钢网及支撑方式和印刷参数验证的标准是否对偏位、转移率、形状有要求。Dothestencilandsupportandprintingparametershasverificationstandards.Isthestandardsincludedeviation,transferrate,andshaperequirements有无验证标准,体积转移率(偏位等)的Cp,Cpk,不良DPPM.CP,CPKandfaultDPPM.7是否有擦拭频率的规定及其合理性Istherethewipefrequencyrequirements.8如何保证印刷机的设备能力满足不同产品工艺要求Howtoensuretheprintingequipmentcapacitytomeetthetechnologicalrequirementsofdifferentproducts可加工PCB最小/最大尺寸印刷精度,CmkPCBmax/minsize,Printingaccuracy,Cmk9有无选择钢网擦拭剂的规则Isthereoptionsstencilcleaningrules10是否有钢网纸的选择规则Istherethestencilwipingpaperselectionrules.纸张的长度大小等。Thestencilwipingpapersize.11是否有刮刀压力的规定Isthererulesaboutthescraperpressure.指导书有说明。WIhascontentaboutthisrules.12是否有印刷速度的规定Isthererulesabouttheprintspeed.指导书有说明。WIhascontentaboutthisrules.13是否有脱模速度的规定Isthererulesaboutthestrippingspeed.指导书有说明。WIhascontentaboutthisrules.14是否有脱模距离的规定Isthererulesaboutthestrippingdistance.指导书有说明。WIhascontentaboutthisrules.15是否有擦拭方式的规定Isthererulesaboutthewipemode.指导书有说明。WIhascontentaboutthisrules.16如何保证板厚设置和实际一致Howtoensurethattheplatethicknessissetaccordwiththeactual.夹片容易损坏,确保钢网和PCB无间隙。TherehasnogapbetweenthestencilandPCB.17换线时如何保证钢网和PCB对准HowtoensurethelocationprecisionofthestencilandPCB.对位精度要求、检查标准、确认方法Locationprecisioncontrol、checkingstandard、confirmmethod.印刷参数PrintingparametersDocumentCode:SUP_M_MEC
本文标题:制造工程能力评估Checklist
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