PCB专业英语培训教材(2)

PCB坏点英语培训教材张健利（frakzhang)JAN.2007目录•ProcessFlow•DefectIntroduction•TestTOPSEARCH一、ProcessFlowTOPSEARCHTOPSEARCHBoardCut(界料)InnerLayer(内层)Pressing压板Drilling钻孔Plated-throughhole沉铜孔金属化OuterLayer外层WetFilm绿油湿菲林SurfaceTreatment表面处理Profiling成型E-test电测Packing包装Output出货LegendPrinting白字二、DefectIntroductionTOPSEARCH1.BoardCut(界料)TOPSEARCH板面胶渍板面杂物板面擦花ResidueonboardForeignmatteronboardScratchonboardsurfaceTOPSEARCH板边凹痕板污凸点凹点针孔擦花UnevenedgeBoarddirtyProtrudespotConcavespotPittingScratchGAME1----播音员规则：每组派一名代表上来带读，其它成员跟着念。由全体学员举手表决，选出最佳“播音员”。TOPSEARCHInkresidueSpacingundersizeInsufficientlinewidthNickcircuitTOPSEARCH油墨残物线间偏小线幼\线偏小线路缺口2.InnerLayer(内层)PoorexposurePoorcircuitScratchcircuitUnderetchingOveretchingTOPSEARCH曝光不良线路不良线路擦花蚀板不清蚀板过度3.Pressing(压板)TOPSEARCHDelaminationWarpageRegistrationBubbleonboardFoldingonboard爆板\分层板曲内层移位板面起泡板面起皱4.Drilling（钻孔）ExcessholeHoleshiftHoledamageDrillburrTOPSEARCH多孔偏孔孔损披锋HolecontaminationBoarddirtyRoughholeBlockholeTOPSEARCH孔灰黑板污孔粗塞孔GAME２----单词认读规则：谁最先读出讲师抽取的卡片上的单词，便可为本组赢得一分。TOPSEARCH5.Plated-throughhole(沉铜)TOPSEARCH擦花孔开板损掉缸ScratchHoleopenBoarddamageDropvat6.OuterLayer（外层）DryfilmresidueForeignmatterunderDFFilmpeeloffPoorexposureInsufficientlinewidthCCTopenTOPSEARCH干膜残物干膜下杂物甩膜曝光不良线幼\线偏小开路SpacingundersizeNickCCT(concave)PoorCCTScratchCCTUnderetchingOveretchingTOPSEARCH线间偏小缺口线路不良线路擦花蚀板不清蚀板过度7.WetFilm（湿菲林）S\MundercureS\MPeeloffOxidationunderS\MForeignmatterunderW\FTOPSEARCH绿油未干甩绿油绿油下氧化湿菲林杂物S\MshiftS\MbleedingS\MinholeS\MskippingS\MbubbleTOPSEARCH绿油移位渗油绿油进孔不过油绿油起泡S\MbridgebrokenPoorS\MPoorcarboninkExcessS\MpointreworkTOPSEARCH绿油断桥绿油不良碳油不良补油点多GAME3----抢答规则：桌子上放有两个盒子，一个装的是坏点英文名称，另一个装的是中文名称。讲师从一个盒子中随意抽取一张卡,组与组之间进行抢答，每组有三次机会（第一个人没有回答上，可以把机会让给组内的其他学员。否则机会就归其他组）。每对一个单词得一分。TOPSEARCH8.LegendPrinting（白字）TOPSEARCHC\MunclearC\MshiftC\MinholeWrong\missingmark白字不清白字移位白字进孔错\漏标记MissingC\MPoorC\MC\MonwrongsideC\MpeeloffTOPSEARCH漏印白字白字不良白字印错面甩白字9.SurfaceTreatment(表面处理)SclholeundersizeSclholeoversizeSolderoverthicknessSolderlumpThinsolderBlockholebysclTOPSEARCH喷锡孔小喷锡孔大锡高锡渣锡薄锡塞孔TOPSEARCHCopperexposeonsolderContaminationonsolderSolderoncarboninkSolderinhole锡面漏铜锡面灰黑锡上碳油锡进孔SclholeroughPoorsolderstrippingPoorsoldersurfaceS\MonpadSMDPitchwidthundersizeGreysoldersurfaceTOPSEARCH锡孔粗糙退锡不良锡面不良绿油上锡指锡指宽广偏小锡面灰GAME4----互相介绍规则：我们刚学过SF里的16个坏点单词，从第一个学员开始，每位学员分别记一个单词，每个单词分别代表每位学员的姓名，记住姓名之后，然后互相介绍。TOPSEARCHWhataredefects?PooronG\FPitongoldfingerNickonG\FScratchonG\FSolderonG\FTOPSEARCH金面不良金面针孔金指穿孔缺口金指擦花锡上金指CopperexposeonrootofG\FS\MpeeloffonrootofG\FG\FbeveledgedeviationInsufficientgoldthicknessTOPSEARCH金脚露铜金指斜边偏差金脚甩油金厚不足W\FonG\FDentonG\FG\FoutofsizeGoldsurfaceoxidationGoldbleedingNickleburntTOPSEARCH绿油上金指金指凹痕金手指变形金面氧化渗金烧镍TOPSEARCHconnectionPitongoldenfingerNickonG\FG\FbeveledgedeviationInsufficientgoldthicknessGoldbleedingNickleburnt金指穿孔缺口金厚不足渗金烧镍金面针孔金指斜边偏差TOPSEARCH10.Profiling（成型）PoorprofilingMissingbeveledgeDamagebypunchingDamagebyrouting碑锣不良锣斜边碑板压伤板锣伤V-CUTshiftV-CUTunderspec.V-CUToverspec.TOPSEARCH移位v-cut过浅v-cut过深TOPSEARCHProcessFlow11.E-Test(电测)12.Packing(包装)13.Output(出货)Theend,thankyou!TOPSEARCH