SMT常用述语

SMTMPT/MicroelectronicPackagingechnologyMixedComponentMountingTechnologyPackagePickandPlaceDesolderingReflowDipSolderingDragsolderingPrintedCircuitPrintedWiringprintedcircuitboardprintedwiringboardlaminatecopper-cladlaminatebasematerialproductionboardprintingconductivepatternprintedcomponentsingle-sidedprintedboarddouble-sidedprintedboardmultilayerprintedboardIronhotairreflowingnoozlesolderingwicktinextractorpost-solderinginspectionvisualinspectionmachineinspectionsolderingjointqualitysolderingjontdefectsolderwrongsolderskipspseudosolderingcoldsolderingsolderbridgeopensolderingsolderoffsolderingnon-wettingsolderballiciclesolderprojectionvoidsolderwickingoverheatedsolderconnectioninsufficientsolderconnectionexcesssolderconnectionfluxresiduesoldercrazeingfillet-liftinglift-offAI:Auto-InsertionAQL:acceptablequalitylevelATE:automatictestequipmentATM:atmosphereBGA:ballgridarrayCCD:chargecoupleddevice()CLCC:CeramicleadlesschipcarrierCOB:chip-on-boardcps:centipoises()CSB:chipscaleballgridarrayBGACSP:chipscalepackageCTE:coefficientofthermalexpansionDIP:dualin-linepackage()FPT:finepitchtechnologyFR-4:flame-retardantsubstrate(PCB)IC:integratecircuitIR:infra-redKpa:kilopascals()LCC:leadlesschipcarrierMCM:multi-chipmoduleMELF:metalelectrodefaceMQFP:metalizedQFPNEPCON:NationalElectronicPackageandProductionConferenceppm:partspermillionPAD()PAD()psi:pounds/inch2/2PWB:printedwiringboardQFP:quadflatpackageSIP:singlein-linepackageSIR:surfaceinsulationresistanceSMC:SurfaceMountComponentSMD:SurfaceMountDeviceSMEMA:SurfaceMountEquipmentManufacturersAssociationSMT:surfacemounttechnologySOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackageSOT:smalloutlinetransistorSPC:statisticalprocesscontrolSSOP:shrinksmalloutlinepackageTAB:tapeautomaticedbondingTCE:thermalcoefficientofexpansion()Tg:glasstransitiontemperatureTHD:Throughholedevice()TQFP:tapequadflatpackageUV:ultravioletuBGA:microBGAcBGA:ceramicBGAPTH:PlatedThruHoleIAInformationApplianceMESHOXIDEFLUXLGA(LandGridArry)LGATCP(TapeCarrierPackage)ACFAnisotropicConductiveFilmSoldermaskSolderingIronSolderballsSolderSplashSolderSkipsThroughholeTouchupBriding()SolderWiresSolderBarsGreenStrength()TransterPressure()ScreenPrintingSolderPowderWettengabilityViscositySolderabilityApplicabilityFlipchipDepanelingMachineSolderRecoverySystemWireWelderX-RayMulti-layerInspectionSystemX-RayBGAOpen/ShortX-RayInspectionMachineBGAX-RayPrepregCopperFoilSheeterP.P.FlexCircuitConnectionsLCDReworkStationBatteryElectroWelderPCMCIACardWelderPCMCIALaserDiodeIonLasersNd:YAGLaserDPSSLasersUltrafastLaserSystemMLCCEquipmentGreenTapeCaster,CoaterISOStaticLaminatorGreenTapeCutterChipTerminatorMLCCTesterComponentsVisionInspectionSystemHighVoltageBurn-InLifeTesterCapacitorLifeTestwithLeakageCurrentTapingMachineSurfaceMountingEquipmentSilverElectrodeCoatingMachineTFT-LCD()STN-LCD(PDA()CMP()(Slurry)CompactFlashMemoryCard(CF)MP3PDADataplayDisk()(SPS)(EMS)PCBHDIboard44milMicro-viaboard5-6milPuddleEffect(STH)(CTH)DepanelingMachineNONCFCSupportpinF.M.ENTEKPCBpadQFDPMTORTFMEATFT-LCD()(Liquid-CrystalDisplaysAddressedbyThin-FilmTransistors)LeadFrameDiscreteLeadFrameICLeadFrameISPInternetServiceProviderADSLSOP:StandardOperationProcedureDOE:DesignOfExperimentWireBondingTapeAutomatedBonding,TABFlipChip:JISISOM.S.D.SFLUXSIR1.RMA(ReturnMaterialAuthorization)Automaticopticalinspection(AOI)Loaderunloaderdispenserdispenservacuumpick&placetoolplacemachinechipmounterwavesolderingsystemsreflowsolderingsystemsself–aligmentskewingtombstoneflyingictincriculttestingfuntiontestingAOIautomatedopticalinspectionXAXIautomatedX-rayinspectionreworkstationcleaningsystemsSMTAI:Auto-InsertionAQL:acceptablequalitylevelATE:automatictestequipmentATM:atmosphereBGA:ballgridarrayCCD:chargecoupleddevice()CLCC:CeramicleadlesschipcarrierCOB:chip-on-boardcps:centipoises()CSB:chipscaleballgridarrayBGACSP:chipscalepackageCTE:coefficientofthermalexpansionDIP:dualin-linepackage()FPT:finepitchtechnologyFR-4:flame-retardantsubstrate(PCB)IC:integratecircuitIR:infra-redKpa:kilopascals()LCC:leadlesschipcarrierMCM:multi-chipmoduleMELF:metalelectrodefaceMQFP:metalizedQFPNEPCON:NationalElectronicPackageandProductionConferencePBGAlasticballgridarrayPCBrintedcircuitboardPFColymerflipchipPLCClasticleadlesschipcarrierPolyurethane()ppmartspermillionPAD()PAD()psiounds/inch2/2PWBrintedwiringboardQFP:quadflatpackageSIP:singlein-linepackageSIR:surfaceinsulationresistanceSMC:SurfaceMountComponentSMD:SurfaceMountDeviceSMEMA:SurfaceMountEquipmentManufacturersAssociationSMT:surfacemounttechnologySOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackageSOT:smalloutlinetransistorSPC:statisticalprocesscontrolSSOP:shrinksmalloutlinepackageTAB:tapeautomaticedbondingTCE:thermalcoefficientofexpansion()Tg:glasstransitiontemperatureTHD:Throughholedevice()TQFP:tapequadflatpackageUV:ultravioletuBGA:microBGAcBGA:ceramicBGAPTH:PlatedThruHoleIAInformationApplianceMESHOXIDEFLUXLGA(LandGridArry)LGATCP(TapeCarrierPackage)ACFAnisotropi