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4Common-usedGLOSSARYofPWB2.1BASEMATERIALAninsulator,consistingoforganicorinorganicmaterialthatsupportsapatternofconductivematerial.2.2BUILD-UPTHICKNESSOverallthicknessofacombinationofmaterials.Unlessotherwiseindicated,thebuild-upthicknesswillrefertotheoverallthicknessofaboardconstructionwherenointernalorexternalconductormaterialresides.2.3SINGLELAYERBOARDAPWBwithonlyonelayerlaminate,mayincludesinglesidedcopperanddoublesidedcopper.AndinUL,wedifferentiatethemintosinglelayersinglesidedandsinglelayerdoublesided.,UL,2.4EDGECONDUCTOR–Aconductorparallelwithandspacednotmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.0.4mmA00.4mmAULstandardsforPWBcertification:ULoUL796Printed-WiringBoardsUL796oUL94TestsforFlammabilityofPlasticMaterialsforPartsinDevicesandAppliancesUL94oUL746EPolymericMaterials-IndustrialLaminates,FilamentWoundTubing,VulcanizedFibre,andMaterialsUsedinPrintedWiringBoardsUL746EoUL746FPolymericMaterials-FlexibleDielectricFilmMaterialsForUseInPrinted-WiringBoardsandFlexibleMaterialsInterconnectConstructionsUL746F2.5IMMERSIONSILVERConsistsofaverythincoatingtypicallylessthan0.55microns(0.0217mils)ofnearlypuresilvercreatedbygalvanicdisplacementandmaycontainaslightamountoforganicmaterialdepositedwiththesilver.0.552.6MAXIMUMOPERATIONTEMPERATUREThemaximumtemperaturetheboardwillbeexposedtointheendproductduringoperatingconditions.2.7MIDBOARDCONDUCTORAconductorspacedmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.DifferentwiththeEdgeConductor.0.4mm2.8DELAMINATIONAplanarseparationofmaterials(i.e.separationbetweenconductorandbasematerial,prepreg,dielectricmaterial,etc.).2.9SOLDERLIMITS:maximumtemperatureandtimesubjectedduringsolderingprocessforcomponentmounting.ButNOTsolderapplicationprocessduringPWBmanufacturing.2.10MAXIMUMAREADIMETERShortenedformisMAD,meansMaximumunpiercedconductorareameasurementMAD,,A–PWB;B–Largestunpiercedconductorsection.;E–LargestcirclethatfitsB(theareaisnottoexceedthatofcircleEinFigure).BE2.11UL94FlameClass:degreeofflammabilityofthematerialUL942.12MinimumCopperThicknessMinimumamountofcopperforconductorlinesorplanes.2.13MeetUL746EDSR:DirectSupportRequirementsarereferenceinTable9.4ofUL746E.Theserequirementsrelatetotheabilityofthematerialtosupportpartsdirectlyontoitssurfacethatcarryelectricalcurrent.DirectSupportvalueisbasedontheIndividuallaminaterecognition.UL746EDirectSupportRequirements()UL746E9.4DSR2.14CTI:ComparativeTrackingIndexisapropertyofelectricalresistanceofamaterialwettedwithionicsolution.CTIvaluearebasedontheIndividuallaminaterecognitionCTICTI1.PWBTypeDesignation:Pleasefillthetypedesignationintheblank,andnotethatpleasedon’tuseANSIgradeorflameratingasthePWBDesignation.UL/ANSIGradeFR-4,V-02.MinimumThicknessPWB:TherequiredminimumPWBthicknessisnottheminimumthicknessofthelaminate,buttheminimumPWBthicknessyouhavecapabilitytoproducethroughyourmanufacturingprocess,whichisalwaysnotlessthanminimumlaminatethickness.TheminimumthicknessofPWBismeasuredwithoutanycopperand/orplating.PWB3.CopperThickness:Pleaseuse“mic”(micron)asunitwhenmeasuringcopperthickness;mic()1oz344.NumberofCladdingSides(SingleorDouble):Pleasefollowyourrequirement,fillinsinglesidedordoublesided.SSDS5.MOT:,(90oC,105oC,130oC),PWBMOTMOT6.SolderLimits():SolderlimitsistheoperatingconditionusedinPWBassembly.Normally,SolderLimitsmaybe260oC300oC/5s~30s.PWBSolderLimits260oC300oC/5s~30s7.PatternLimits():MinimumEdgeConductorWidthshouldbenolessthantheMinimumMidboardConductorWidth,andnomorethanthreetimesofMinimumMidboardConductorWidth.Whenanedgeconductorisnotprovidedwithawidthoflessthanthreetimestheminimumwidthofamidboardconductor,ortherequiredMinimumEdgeConductorcannotbeprovided(thedistancefromtheboardedgeshouldbefrom0to0.4mm,butshouldnotbeshearedalongtheboardedge),thentheboardshallbeassignedanedgeconductorwidthatthreetimestheminimummidboardconductorwidth.Ifnoconductorwidthisprovidedinthissheet,theywillbegivenbasedontheactualmeasurementofULLab.Normally,MaximumUnpiercedAreaDiameter(MAD)maybe25.4mm,38.1mm,50.8mm,76.2mm,etc.Andpleasereferto2.10toviewthedefinitionofMAD.3UL(0.4mm),,MAD25.4mm,38.1mm,50.8mm,76.2mmBOMPreparationofRigidPWB3.1PWB3.1.1SingleLayerPWB:SSDSPWB3.1.2MassLaminatedPWB:ULMassLaminationPWB3.1.3MultilayerPWB:PWBLaminatePrepregTable3.SolderResistsUsedforSingleLayerPWB3.SingleLayerPWBType()SolderResistsApplied()No.DesignationULFileNo.ULSolderResistsMfrColor1.2.SolderResist(s)PleaseprovidethesolderresistsusedinyourPWBsinPWBSolderResistListTable.IfthereismorethanonePWBdesignation,pleasemakesurethesolderresistsareinaccordancewithdifferentPWBdesignations.PWBPWB3.2.2TypicalBOMforMassLaminatedPWB/Table4.DesiredParameterforMasslaminatedPWB4..YourDesiredPWBParameters1.PWBTypeDesignation2.MinimumThicknessPWB______mma.Maximum______mic3.CopperThicknessb.Minimum______mic4.NumberofCladdingSides(SingleorDouble)5.MaximumOperatingTemperature(oC)______oCa.Temperature(oC)______oC6.SolderingLimitsb.Time(seconds)______seca.MinimumMidboardConductorWidth______mmb.MaximumUnpiercedAreaDiameter______mm7.PatternLimitsc.MinimumEdgeCond