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主要元件封装图BGABallGridArrayCPGACeramicPinGridArraySBGALGAEBGA680LPGAPlasticPinGridArrayFBGALBGA160LuBGAMicroBallGridArrayQFPQuadFlatPackagePBGA217LPlasticBallGridArrayLQFPPQFPSBGA192LCLCCLDCCTSBGA680LLCCPLCCTQFP100LJLCCSOT26SOT363SOJLQFP100LSOSmallOutlinePackageSSOPMETALQUAD100LHSOP28TSOPThinSmallOutlinePackagePQFP100LTSSOPorTSOPIIThinShrinkOutlinePackageSOHLAMINATETCSP20LChipScalePackagePCMCIASNAPTKLAMINATECSP112LChipScalePackageSNAPTKSNAPZPCERQUADCeramicQuadFlatPackFlatPackSOT220LLP8LaSOT223SOT223SODIMMSmallOutlineDualIn-lineMemoryModuleSOT23Socket603FosterSOT23SOT323SOT25SOT353SOT343SOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOT523SOT89SOCKET423Forintel423pinPGAPentium4CPUTO252TO263TO268SOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUC-BendLeadCeramicCaseSOCKET7ForintelPentium&MMXPentiumCPUGullWingLeadsSC-705LPDIPSDIPPSDIPSOJ32LPCDIPDIPDualInlinePackageSOPEIAJTYPEII14LDIP-tabDualInlinePackagewithMetalHeatsinkFDIPSSOP16LZIPZig-ZagInlinePackageCNRCommunicationandNetworkingRiserSpecificationRevision1.2SIPSingleInlinePackageSIMM30SingleIn-lineMemoryModuleSOT220SIMM72SingleIn-lineMemoryModuleFTO220SIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconnectITO3pITO220TO18TO71TO220TO72TO247TO78TO264TO8TO3TO92TO5TO93TO52TO99
本文标题:主要元件封装图
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