Gold wire recognition

ASSY(I)ASEKHPEW/BPROJECTGOLDWIRERECOGNITIONASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionBasicwirebondcompositionfactor:Basically,wirebondiscomposedofdice,substrate(leadframe),wirebonder,capillaryandbondingwire.(Showasbelowfigure)單層鋁墊In-line雙層鋁墊Staggered三層鋁墊Tri-tier四層鋁墊Quad-tier大pitchBigpitch小PitchSmallpitch大pitchBigpitch小pitch(smallpitch)大pitchBigpitch小pitch(smallpitch)小銲針(Smallcapillary)大銲針(Bigcapillary)小線徑(Smalldiameter)大線徑(Bigdiameter)線徑Diameter線徑DiameterASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionPurposeofbondingwire:Bondingwireconnectsdiceandsubstrate/leadframetoformcompleteelectricalloop.CharacteristicofAu:優點:a.化學性質安定.b.優越的耐腐蝕性.c.是所有金屬中延展性最佳者.能加工至極細線.d.吸塵性小.e.具高度導電性.f.具適度柔軟性.缺點:a.價格高.b.與鋁合成金屬化合物.c.強度弱.d.容易刮傷.Generalbondingwirematerial:ElementProperties19.38.92.713.321.74.80.420.600.6310631083660AuCuAgDensity(g/cm3)Tensilestrength(kg/mm2)Conductivity(MΩ-1cm-1)Meltingpoint(0C)ASSY(I)ASEKHPEW/BPROJECT(1).Mitsubishi:123456784Ngold(99.99%)RefiningMelting&castingCaliberrollingDrawingAnnealingWindingPacking&Shipping(2).Sumitomo:12345675Ngold(99.999%)DopantIngotmakingRollpressSinglediesdrawingHeavydrawingIntermediateannealingFinedrawing1098FinalproductsRewindingFinalproducts＋Manufacturingprocessofgoldwire:GoldWireRecognitionASSY(I)ASEKHPEW/BPROJECT(1).Mitsubishi:123456784Ngold(99.99%)RefiningMelting&castingCaliberrollingDrawingAnnealingWindingPacking&Shipping(2).Sumitomo:12345675Ngold(99.999%)DopantIngotmakingRollpressSinglediesdrawingHeavydrawingIntermediateannealingFinedrawing1098FinalproductsRewindingFinalproducts＋RollpressDrawingDieDrawingFinedrawingAnnealingWindingGoldWireRecognitionIllustrationofgoldwireprocess:ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionProcessPurposeRefining[純化]99.99%Au→99.999%Au[4N的金純化到5N的金]Meltingcastingingot(Dopingelements)[熔解與鑄造金柱][摻雜元素]Metallurgicalcharacteristicsadjustment(Wiretype)[冶金特性調整][金線型號]Rolling&Drawing[滾動與抽動]Finaldiameteradjustment[線徑作最後調整]Annealing(Heattreatment)[退火][熱處理]Mechanicalproperty'sadjustment[機械特性調整]Winding&Inspection[纏繞及檢查]Forcustomer'sspecification[客戶需求]Purposeofwiremanufacturingprocess:Twomainprocess-MeltingandAnnealingProcess1.Meltingprocess(Kindandamountofdopingelements)(1).FAB&1stbonding(shearstrength)(2).Ballneck&Pullstrength(3).LengthofHAZ&Loopshape2.Annealingprocess(Heattreatment)(1).Breakingstrength&Wiresweep(2).Elongation&StraighnessofloopASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionGoldwiredatasheetlist:AW88AW6620+/-0.520+/-0.56-116-105-105-92-62-6NANA5-105-93.43.41.81.70.80.855-6555-65TransitionTransition80-9078-8865-7556-6619.319.30.00340.00343.173.1714.214.29090~450~450106310630.550.552.32.3299.9999.99Be1010Ca3545Ag105Cu55Fe55SPECIFICATIONPROPERTYITEMDopantRatio(ppm)Resistivity(uOhmcm)@200CGeneralPropertiesWireDiameter(um)BreakingLoad(g)Elongation(%)RoomTemp.HighTemp.2500CFreeAirBall(FABdiameter33um)HAZRoomTemp.HighTemp.2500CThermalConductivity@200C(W/cmK)CoefficientofLinearThermalExpansion(20-1000Cppm/K)NeckBreakingLoad(g)PhysicalPropertyGrainSize(um)FreeAirBall(FABdiameter33um)HAZWireHardness(HV,10mN,5s)FusingCurrent(A,Length=5mm)ComponentPropertyAuPurity(%)WireElasticModulus(GPa)Recrystallizationtemp.(C)MeltingPoint(Deg.C)HAZLength(um)(FABdiameter33um)Density(g/cm2)TemperatureCoefficientofEl.Resistance(0-1000CperK)ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionAccordingtodifferentannealingprocesswhichcangetdifferentbreakingloadandelongationvalue.Breakingstrength(gf)WiresweepElongation(%)StraightnessofloopElongation(E/L)&Breakingload(B/L):ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionε1ε23%4%6~8%ε(Elongation)σ2σ1σ應力彈性疲乏區TypeCTypeBTypeAElongation(E/L)&Breakingload(B/L):其特性為在擬靜態拉力測試中,其長度由L1變成L2ΔL=L2-L11.Elongation之定義則為(ΔL/L)=((L2-L1)/L12.BreakingLoad在即為在這樣的條件下而斷裂之力量PBElongation(延展性)和BreakingLoad(斷裂強度)為金線本身最重要的特性之一E(Young’sModulus,揚氏係數)σ/ε=(σ2-σ1)/(ε2-ε1)由於作拉力測試時,一超過彈性疲乏區之後,則金線截面積A變小且不會呈線性變化而會呈非線性變化由左圖可知正常的Elongation下,BreakingLoad較大的金限其Yong’sModulus也比較高:TypeBTypeA故TypeA之金線比TypeB硬而TypeC之金線則可同時擁有較高之硬應力P1P2P1P2(Force)L1L2ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionNeckbreakingload:ASSY(I)ASEKHPEW/BPROJECTHeatAffectedZone(HAZ):GoldWireRecognitionSmallHAZcanperformlowloopheightlooping.ForspecialpackagecouldselectspecificHAZASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionGrainsize:ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognition1.4WD1.6WD1.8WD2.0WDHAZLengthHAZLengthWirediameter(1.0mil)FreeAirBallSize100120140160802.0WD1.8WD1.6WD1.4WDHAZLength(um)VariationofgrainsizeatHAZaccordingtoFABsize1.4WD1.6WD1.8WD2.0WDGrainsize(um)2.2~3.32.5~3.62.8~3.93.3~4.4Fig.1HAZLengthFig.2HAZlengthaccordingtoFABsizeGrainsize:ASSY(I)ASEKHPEW/BPROJECTGoldWireRecognitionCauseofgrainsizevariationatHAZConductedamountofheatdeviatesaccordingtoEFOcurrentvariationduringFABforming.Grainsinwirerecrystallizesbyconductedheatamountandtherecrystallizedgrainsizeislargerthantheoriginalgrainsize.Lengthofsuchrecrystallizationpartincreaseswithcurrentamount.Whenrecrystallizedpartislong(whenFABsizeisbig),itbecomessoftsincerecrystallizedgrainsizeisbigduetolargeamountofheatconductiona