常用英语词汇

常用英语词汇Sharlin20150925•前模/定模/母模cavity(cavity也叫模穴）•后模/动模/公模core(core统称模芯,模仁）•枕位、穿插、碰穿shutoff•直径diameter•圆角/半径radius•重叠overlap•导向槽guidingslot(不动的部分）•倒扣undercut•切线tangent•脱模角度、拔模锥度draftangle•分模线/分型面partingline=PL•行位分型线sliderPL模具用语行位、滑块slider（移动的部分）行位孔sliderhole行位/滑块运动方向slidermovementdirection（箭头所示）行位夹线sliderline（红色线条）•骨位rib•槽slot•段差step•圆顶针ejectorpinround缩写是EPround•扁顶针ejectorpinblade（blade原意是刀片，叶片）•平均胶位厚度Theaverageplasticthickness•模镶件线coreinsertline•隧道行位Tunnelslider•锁模力clampforce•热流道hotrunner•便于出模releasethetooleasily•后模镶件coreinsert•排气镶件gasventinsert•镶针insertpin•为了更好的走胶toimproveplasticflowing/forbettermaterialflowing•模穴号刻在顶针上engravethecavity#ontheE/Ps•产品刻字位置letteringlocation•刻字字宽width1.2mm，字凸convex0.07mm•绝缘resistcoating•相切半径tangentradius•电镀夹片rackingtab•斜顶lifter•内圈分型线insidepartingline•demold脱模•aspertheissuesabove上述问题•扣位clip•intersect[,intə'sekt]vi.相交，交叉（两条直线或两个平面相交）vt.横断，横切；贯穿•正段差是后模比前模小，逆段差就是前模比后模小。都用step•色粉colorant•水口残留Gatevestige•EPEfoam珍珠棉(ExpandAplePolyEphylene)•损耗率scrapratescrap：废弃，残留•标准样板mastersample•限度样板boundarysample•颜色限度样品colorboundarysample•缺陷样板defectsample•产品V/P切换压力为57.5MPa•PressureatV/Pswitchoveris57.5Mpa•模流分析moldflowanalysis•体积收缩volumetricshrinkageatejection•缩痕估算sinkmarksestimate•总体变形alleffectsdeflection•X.Y方向变形deflection,alleffects:X.Ycomponent•蚀纹texture，graining•贴胶带felttape•吸塑包装blisterpackaging进胶方式•香蕉嘴进胶bananagate•侧进胶Sidegate•气阀进胶Valvegate•月亮形进胶:moongate•直入水(大水口):Directgate潜进胶SubgateTunnel-gate,搭底进胶Overlapgate/tabgate点进胶/点胶口pinpointgate翻译实例•1由于加工精度问题，行位孔与模仁上骨位深度很难刚好做平，现将产品骨位此处减胶0.05mm，请知悉，左右两个孔一样.•Becauseoftheaccuracyofthemanufacture,itisdifficulttomakethesliderholethesamelevelwiththecoredepth,sowesuggestreducing0.05mmplasticontheribs,pleasemakethesamechangetobothLH&RHholes.•2建议前后模大分型线处做段差（后模做小单边0.05mm）WesuggestmakingsteponthePLbetweencavityandcore（reduce0.05MMplasticonsinglesideofcore）•3怕结合力不好，建议第一色做孔，增加结合力.•Wesuggestaddsomeholesonthefirstshotinordertoincreasetheadhesionstrength•4为利于模具制作及简化分型面，建议箭头所指侧面减胶拔模到后模.•Wesuggestthebyarrowindicatedsidereducematerialandmakingintothecoreinordertomanufacturethetooleasierandsimplifythepartingline.•5建议上图中两个绿色孔侧面沿行位运动方向做脱模斜度•Wesuggestaddingdrafton2greensidesalongthemovingdirectionofslider.•6为了保证外观面，建议将PL面下移0.2MM。•SuggestloweringthePL0.2MMtoavoidthePLonthevisiblesurface.•7此绿色面没有出模角，建议以减胶方式做3度的出模角以便行位出模。•Nodraftingreenarea,suggestreducingplasticanddraftangle3degreetoreleasetheslidereasily.•8此处掏胶掏进去0.6MM.•Herereduce0.6mmplasticinjection.•9此处打1圆点或2圆点作为型腔号，请确认！•Make1dotor2sasthecavitynumber•10产品此两处侧面绿色面为直身面，为防止产品此面脱花或拉伤，需增加出模角度0.5°（产品减胶）•Thegreenareahavenodraftangle,toavoidanyscratch,wewouldliketoreduceplasticfor0.5°draftangle.•11后模绿色骨位没有脱模斜度•thereisnodraftoncoreribs•12为了防止扣位粘行位,行位如图示增加顶针•AddEPonslideraspictureinordertoavoidtheribsticktoslider•13浇口修剪残余量在0.2mm以下•Gatevestige:≤0.2mm.•14下限为进胶点下部•lowerlimitisthebottomofgate•“R”:RadllGuage(R规)•“L”ruler(直尺)•“F”Feeler(塞尺)•“GONO-GO”：GeneralGuage(通止规)•Fixture(辅具/夹具)•Gage(检具)•“T”Taperedclearance(锥形间隙尺)•“S”StepGauge(段差尺)试验测试工具•fixture/jig（基度）（实验室称呼治具为基度）•“V”:VernierCaliper(卡尺)•“H”:HeightGuage(高度规)•“M”:Micrometer(千分尺)•“D”:DialGuage(百分表)•“P”:Projector(投影仪)•“E”:Visual(目视)•“C”:CoordinateMeasureMachine(三次元）•“G”:PinGuages(针规)•plugguage（塞规）（用于测孔距）•Flushgauge(齐平规）黑点BlackDot披锋Flash流纹Flowmark气纹Gasmark/Flowmark缩水Sinkmark/shrinkage变形Deformation亮印Brightspot擦花/划伤Scratch碰伤bumpping胶泡Bubble夹线Weldline/nitline针孔pinhole缺胶ShortShot顶针印Ejectormark烧焦Burn打砂印sandpapermark多胶extramaterial漏光LightLeaks模伤/模痕mouldmark沙粒Grain/particle亮点Shiningdot光剂Brightliquid/Brightnesschemistry模伤/模痕mouldmark压伤impression胶件常见缺陷电镀常见缺陷披风Flash颜色偏亮Bright颜色偏哑Dull/Matt发蓝Blue发蒙Cloud/foggy漏镀Missplating多镀/通电Over-plating起皮/脱皮peelingoff烧铬Burn毛刺Burr产品变形Deformation黄水印yellowmark麻点pitting脏污Dirty杂质impurity发霉mildew断裂Broken水印Watermark水口削缺Spruedamage起泡bubble翘皮/边raise划伤/擦花scratch未电亮notbright油点/印greasemark亮点/印brightmark凹点/印dentmark挂伤rackmark碰伤(缺)bumping削伤(缺)cuttingmark裂纹crack气/射纹jettingmark起皱corrugation缩痕/缩水sinkmark/shrinkage缺口gap白点whitedot阴阳色Colordifferent/ColorvariationPlatingSequences电镀步骤Pretreatment前处理Basematerial基材Etching蚀刻Activation活化Accelaration解胶ElectrolessNickel化学镍PlatingSequences电镀步骤Electro-Plating电镀WattsNickel瓦特镍orPreCopperSemiBrightNickel半光镍BrightNickel光镍AcidCopper酸铜MicroporousNickel微孔镍Chromium铬SatinNickel珍珠镍MicrocrackNickel微裂纹镍2012/11/2223补充知识•铬的电镀要求•CurrentDensity电流8-10A/dm2•Efficiency效率16-20%•PlatingSpeed电镀速度0,15-0,25mm/min应力消除Stressrelief除油、除蜡CleaningAndDegreasing粗化Etching钯活化PalladiumActivation解胶（还原）PalladiumActivation化学镍ElectrolessNickel化学镀镍、铜ChemicalPlatingofNickel&Copper微孔Microporous微孔数NumberofMicropores微裂纹Microcrack产品设计ProductDesign模具设计MoldDesign模具制造MouldManufacturing注塑InjectionMolding电镀工艺ElectroplatingProcess塑胶材料PlasticMaterials挂具设计RackDesign2012/11/2225外观、功能Appearance&FunctionThankyou!欢迎补充