JIS Z3198-3-2003 英文版 无铅焊剂的试验方法.第3部分敷量的试验方法

JISJAPANESEINDUSTRIALSTANDARDTranslatedandPublishedbyJapaneseStandardsAssociationJISZ3198-3:2*03Testmethodsforlead-freesolders-Part3:MethodsforspreadtestICs25.160.50Referencenumber:JISZ3198-3:2003(E)PROTECTEDBYCOPYRIGHT5sCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:29:01MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-3:2003ForewordThistranslationhasbeenmadebasedontheoriginalJapaneseIndustrialStandardestablishedbytheMinisterofEconomy,TradeandIndustrythroughdeliberationsattheJapaneseIndustrialStandardsCommitteeaccordingtotheproposalofestablishingaJapaneseIndustrialStandardfromTheJapanWeldingEngineeringSociety(JWES),withadraftofIndustrialStandardbasedontheprovisionofArticle12Clause1oftheIndustrialStandardizationLaw.SolderingiscalledHANDAZUKE(Japanese),atechniquetobeusedformountingelectronicandelectricalmachineryandapparatus,communicationequipmentandthelikeanditsusefieldiswideandexpectationforhighreliabilityoftheconnectionislarge.ThoughtherearestandardsinsideandoutsideJapanaswellasInternationalStandardslikeIECorISO,thisStandardusesresultsof“standardizationoftestmethodsandthelikenecessaryforsolderconnectioncorrespondingtothereductionofanenvironmentalload”basedontheresearchanddevelopmentbycontractofNewEnergyandIndustrialTechnologyDevelopmentOrganization.ThisStandardconcernsthemethodsforspreadtestoflead-freesolderswhichareenvironmentallyfriendlyandispositionedasastandardforconsideringenvironment.AttentionisdrawntothepossibilitythatsomepartsofthisStandardmayconflictwithapatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavetechnicalproperties.TherelevantMinisterandtheJapaneseIndustrialStandardsCommitteearenotresponsibleforidentifyingthepatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavethesaidtechnicalproperties.JISZ3198includesthefollowing7partswiththegeneraltitleTestmethodsforlead-freesoldersPart1:MethodsformeasuringofmeltingtemperaturerangesPart2:Methodsfortestingofmechanicalcharacteristics-tensiletestPart3:MethodsforspreadtestPart4:MethodsforsolderabilitytestbyawettingbalancemethodandacontactanglePart5:MethodsfortensiletestsandsheartestsonsolderjointsPart6:Methodsfor45”pulltestofsolderjointsonQFPleadPart7:MethodsforshearstrengthofsolderjointsonchipcomponentsmethodDateofEstablishment:2003-06-20DateofPublicNoticeinOficialGazette:2003-06-20Investigatedby:JapaneseIndustrialStandardsCommitteeStandardsBoardTechnicalCommitteeonWeldingJISZ3198-3:2003,FirstEnglisheditionpublishedin2003-12Translatedandpublishedby:JapaneseStandardsAssociation4-1-24,Akasaka,Minato-ku,Tokyo,107-8440JAPANIntheeventofanydoubtsarisingastothecontents,theoriginalJISistobethefinalauthority.OJSA2003Allrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromthepublisher.PrintedinJapanPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:29:01MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-3:2003ContentsPageIntroduction.................................................................................................................12345677.17.27.37.48Scope....................................................................................................................Normativereferences........................................................................................Definitions..........................................................................................................Outlineoftest....................................................................................................Materialandreagents......................................................................................Apparatusandequipment...............................................................................Procedureoftest................................................................................................Pretreatmentofcoppersheet........................................................................Shapeofsamplesolder...................................................................................Flux(Halogen-activatedrosinflux).............................................................Test....................................................................................................................Calculationofspreadrate...............................................................................1111112333444PROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicens