圆筒、封头及开孔补强计算

设计压力PMPa0.8801.4设计温度tCO50曲面高度设备内径Dimm1500形状系数材料许用应力[σ]tMPa113.0许用应力[σ]tMPa113.0计算厚度δmm5.86焊接系数φ1.00厚度负偏差C1mm0.80腐蚀裕量C2mm1.00厚度附加量Cmm1.80所需厚度mm7.66t1℃20名义厚度δnmm10t2℃50[σ]t1113接管规格DN36100[σ]t2113系数P50；0.9K1内插值[σ]t113开孔处计算厚度δ5.865.86接管外径Dtw36108常温许用应力[σ]MPa113.00名义壁厚δnt12.04.0试验压力PTMPa1.10接管内径Dti12.0100.0有效厚度δemm8.200.15*δnt1.800.60圆筒应力σTMPa101.16材料负偏差Ct11.80.68材料屈服点σsMPa235.00腐蚀裕量Ct21.01.0试验许用应力0.9*σsMPa211.50厚度附加量Ct2.801.680.9*σsσT焊接系数φt1.001.00211.5101.16接管许用应力[σ]tt110.0130.0接管计算厚度δt0.070.35dND2dND2开孔直径d17.60103.3650130225440所需补强面积A103.20606.0665160250480外侧有效高度h114.5320.3380180300550内侧有效高度h2(1.00)10.00100200350620削弱系数(接管/壳体)fr0.971.00125250400680壳体多余面积A140.0241.5150300450760接管多余面积A2242.3106.5175350500840焊缝面积A336.0036.00200400600980需另补强面积A4(215)222补强圈外径Db72200补强圈计算厚度δb(5.98)2.41Q235-B内插法计算许用应力许用应力计算开孔补强计算圆筒、封头及开孔补强计算设计条件厚度计算圆筒JB/T/4736-2002补强圈dN×t-C圆筒水压试验校核≥1.3himm375K1.00[σ]tMPa113.0δmm5.85C1mm0.80Cmm3.20mm9.05δnmm1005008000.900.905.865.865.275.27053089.00.06.06.05.00.0(12.0)406.079.00.00.900.900.7500.90.80.6751.01.01.01.901.801.680.001.000.801.001.00123.0113.0130(0.03)2.000.280.00(8.20)409.6082.40.0(48.08)2401.714340#NUM!49.5720.290.0010.0010.0010.000.001.001.001.000.00(19.2)957.01260#NUM!281.79170.10.036.0036.0036.0036.00#NUM!1127101(36)4808401800#NUM!3.641.11#DIV/0!圆筒、封头及开孔补强计算厚度计算封头圆筒封头