SMT制程简介

SMT製程簡介SMTPROCESSINTRODUCES.M.T.SurfaceMountTechnology•定義：是指在恰當材質的表面上焊牢為數極多的表面粘裝電子零件(SMDs)的裝配技術.•DEFINITION:Atechnologyformountingelectroniccomponents(=SMDs)onthesurfaceofsuitablesubstrate.S.M.D.SurfaceMountDeviceSMD定義:亦稱為SMC,是指能夠藉由表面粘著技術焊接在印刷電路板上之有腳或無腳電子零件.DEFINITION:(orsurfacemountcomponent,SMC),Itisaleadorleadlesselectroniccomponentthatiscapableofbeingattachedtoaprintedboardbysurfacemounting.SMTFLOW領料ReceiveMaterials備料PrepareMaterials錫膏印刷Printingsolderpaste零件置放Pick&PlaceCP7X3QP3X4迴焊Reflow迴焊Reflow零件置放Pick&PlaceCP7X2GSM2X2錫膏印刷Printingsolderpaste轉版ReverseBoardAOIAutoOpticalInspectionAOIAutoOpticalInspection目檢VisualInspection條碼管理系統SFIS入庫ToEnterWarehouse出貨DeliverGoodsAOIAutoOpticalInspection1OKNG下一程序NextProcedure修整TouchUp目檢VisualInspectionOKNG修整TouchUp下一程序NextProcedure目檢VisualInspection2SMTEQUIPMENT-I•MPMUP3000-StencilPrinter-印刷机•FUJICP643E-High-SpeedMounter-高速置件機(SmallCard)•FUJICP742E/742ME-High-SpeedMounter-高速置件機(Mainboard)•FUJIQP341E-Multi-Fun.Mounter-泛用置件機•UNIVERSALGSM2-Multi-Fun.Mounter-泛用置件機•HELLER1900EXLReflow-迴焊爐•ORBOTECHVT.8000X-AutoOpticalInspectionForSolderJoint-焊點自動光學檢查機•ORBOTECHTrin.2240-AutoOpticalInspectionForPaste-錫膏覆蓋自動光學檢查機•EFD1500XL-GlueDispensermachine–點膠機SMTEQUIPMENT-II•HOTPLATE-SolderBallTest-錫球試驗儀•MALCOMVISCOMETERPCU-201-ViscosityTest-粘度測試儀•HIROX-3DMicroscope-3D顯微鏡•Z-CHECK-SolderPasteThicknessMeasurement-錫膏厚度量測儀SMTEQUIPMENT-III•DATAPAQREFLOWTRACKER-ReflowTemperatureCurveRecord-迴焊爐溫度曲線記錄器•FUJIDTIII-2DMeasurement&FeederCalibration-座標機•EMC301A-StencilCleaner-鋼板清洗機領料(GETTINGTHEMATERIALS)1.工程目的(ENG.PURPOSE)：領取生產用料Preparetheproductionmaterials.2.作業重點(OPERATIONIMPORTANTS)：2.1實物與領料單規格相符Thematerial’sspecificationmustbethesameasyourBOM.2.2數量正確Quantitymustbecorrect.SolderPaste-ISQ-20-27•Non-cleanType-免洗型•0%Halogencontent-無鹵化物•20-36mparticlesize-錫球直徑20-36m•9.0%Fluxcontent(RMA)-助焊劑比重9%SolderPaste-IISQ-20-27•IncomingmaterialInspection-進料檢驗SolderballTest-錫球試驗ViscosityTest-粘度試驗•Storage-儲存條件0~10℃錫膏印刷-I(PRINTINGSOLDERPASTE)1.工程目的(ENG.PURPOSE)：均勻地印刷錫膏Uniformdepositingsolderpaste.2.作業重點(OPERATIONIMPORTANTS)：2.1確認程式名稱Confirmthecorrectprogram.2.2確認鋼板名稱與作業標準書相符ConfirmthestencilnamebytheSOP2.3錫膏印刷品質Theprintedquality.錫膏印刷-II(PRINTINGSOLDERPASTE)•STENCILTHICKNESS=0.13mm-鋼板厚度=0.13mm~Lasercut-鐳射切割•STENCILTENSION30N/cm-鋼板張力30N/cm•SOLDERPASTETHICKNESSMEASUREMENT~X-RChart-錫膏厚度量測X-R管制圖點膠(Glue)•SOAKOTEIR-010•KOKIJU-21•MatsushitaADE441D-2251.工程目的(ENG.PURPOSE)：黏著零件Tostickcomponents2.作業重點(OPERATIONIMPORTANTS)2.1確認設備壓力Confirmthemachinepressure.2.2使用正確的膠水UsingthecorrectGlue.2.3點再正確的位置PuttheGlueoncorrectlocation.1.工程目的(ENG.PURPOSE)：正確的放置零件Placethecomponentinthecorrectlocation.2.作業重點(OPERATIONIMPORTANTS)2.1確認程式名稱Confirmthecorrectprogram.2.2使用正確的材料Usingthecorrectmaterials.2.3正確的置放方向性Placecorrespondingpolaritycorrectly.零件置放-I(PICK/PLACE)零件置放-II(PICK/PLACE)•BartectorSystem-條碼掃瞄•ComponentBarcodeLabel-元件條碼•VacuumPackageComponentStorage-真空包裝零件儲存•Pick&PlaceMisplacementRecord-置件偏移記錄迴焊(REFLOW)1.工程目的(ENG.PURPOSE)：焊接熔接Soldering2.作業重點(OPERATIONIMPORTANTS)：2.1使用正確的程式名稱Usingthecorrectprogram2.2確認溫度/輸送設定與作業標準書相符Confirmthesametemperature&conveyorastheSOP2.3溫度曲線量測MeasuringofreflowtemperatureprofileAOI(AutoOpticalInspection1.工程目的(ENG.PURPOSE)：以影像檢查焊點及置件品質DetecttheSolderJointandPlacingAccuracybyImage.2.作業重點(OPERATIONIMPORTANTS)：2.1使用正確的程式名稱Usingthecorrectprogram.目檢(VISUALINSPECTION)1.工程目的(ENG.PURPOSE)：目視檢驗外觀不良Visualinspectionfortheunacceptableboards2.作業重點(OPERATIONIMPORTANS)：2.1PCB及焊點外觀PCBandSolderjointappearance2.2缺件/錯件/極反/偏移/立碑MissParts,WrongParts,OppositeDirection,ShiftPosition,Tombstone修整(TOUCHUP)1.工程目的(ENG.PURPOSE)：符合外觀工藝標準MustbepassintheWORKMANSHIPSTANDARD2.作業重點(OPERATIONIMPORTANTS)：2.1焊點外觀Solderjointappearance2.2正確的使用烙鐵Usingthesolderironcorrectly