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DKDFTgTdZ-CTET288(1GHZ)(1GHZ)(DSC)(TGA)(50-260)(min)S7439(EL230T)/3.80.0045200℃380℃/>60minS7240/3.90.005200℃360℃2.00%>60minEL190T/4.30.011220℃345℃/20minFL700/3.70.003205℃350℃/20minFL700LD/3.50.0025205℃350℃/20minIT200LK/3.80.01200℃350℃2.50%30minIT150DA/3.560.0047172℃350℃3.81%30minFR4083.770.011180℃360℃3.50%20FR408HR3.680.009200℃370℃2.80%30IS680-345/3.450.0035192℃376℃2.90%60minN4103-133.70.009210℃365℃3.40%10N4103-13EP3.70.009210℃350℃3.50%10+N4103-13SI3.40.008210℃365℃3.50%10+N4103-13EPSI3.40.008210℃350℃3.20%10+Mercurywave9350/3.70.004200℃360℃2.50%40minM4(R5725)FR4+PPO3.80.005175℃362℃2.80%30M6(R5775K)PPO3.60.002185℃410℃/60minTU-872/SLK/3.80.008200℃340℃/20minTU-872/SLKSP///////EMCEM828/3.70.008170℃380℃/30minFX-2/3.50.002180℃350℃/60minMCL-LX-67/3.50.005235℃///RO4350B碳氢化合物+陶瓷3.480.0031280℃390℃0.63%60minRO3003PTFE陶瓷30.0013/500℃//RO4533PTFE陶瓷3.30.0025/500℃//RO3730PTFE陶瓷30.0016/500℃//TC350PTFE陶瓷3.50.002/567℃1.20%>60minAD300CPTFE陶瓷2.970.002/555℃/>60minCLTE-ATPTFE陶瓷30.0013/529℃/>60minMulticlad/3.70.004205℃432℃1.20%>60minRF35A2PTFE+玻纤3.50.0011/528℃2.65%/TLY-5PTFE+玻纤2.20.0009////TSM-30PTFE+玻纤30.0015////TLX-8PTFE+玻纤2.450.0015////SYST供应商板材树脂类型材料特性ITEQISOLAFR4+碳氢化合物NECLOCE(氰酸酯)常用PCB高速高频板材供应商参数一览表HITACHIROGERSARLONTACONICTUCPanasonicRF35PTFE+玻纤3.50.0018////TLC-30PTFE+玻纤30.028////TACONIC吸水率(%)0.08%/网络设备、测量设备0.10%/背板、服务器、路由器//////0.24%//0.10%//0.12%//0.15%//0.06%3.2/0.10%5/0.10%3.90.10%3.90.10%3.90.10%4.30.15%/0.14%40.14%5.8/3.3///3.3////0.03%10.3/0.03%8.4/0.06%8.3卫星电视LNB、微带线、功率放大器<0.1%16.7通讯卫星、背板<0.02%25蜂窝基站天线0.04%25基站天线、卫星传输天线0.05%6.5功率放大器、过滤器、连接器0.06%8.3基站天线、功率放大器0.03%16.5汽车雷达、感应器0.10%4背板、功率放大器、接收器0.02%18<0.02%/0.03%36<0.02%/应用领域材料特性价格指数无线链路、发射机、功分器、合流器、过滤器、基站天线常用PCB高速高频板材供应商参数一览表汽车、航空、防卫、通讯基础设备、半导体、高速数据0.03%14<0.02%/无线链路、发射机、功分器、合流器、过滤器、基站天线备注(目前状态)未评估未评估未评估未评估未评估未评估初步评估(F1)板厚≤2.0mm,Pitch≥0.8mm小批量生产(F5)板厚≤3.0mm,Pitch≥0.8mm文件已标准化未评估未评估文件已标准化(F5)初步评估(F1)未评估未评估未评估未评估未评估小批量生产(F1&F5)初步评估(F1)未评估未评估未评估未评估未评估未评估初步评估(F1)未评估未评估未评估评估结论常用PCB高速高频板材供应商参数一览表文件已标准化(F5)初步评估(F1)未评估
本文标题:常用PCB高速高频板材供应商参数一览表
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