半导体后段厂之现场生产流程与作业管制条件分析

-1-/,(1999)(WaferFabrication)(CircuitProbingCP)IC(ICPackaging)FinalTestingICWork-In-ProcessWIPWIPWIPWIPProcedureWIPICIC71-2-WIPWIPTrackingSystem(ManufacturingProcessRouting)WIP41.ICIC2.-3-WIP3.LeadFrameBGABallGridArrayFlipChipIC4.WIP5.ICDieBondDieBond6.-4-WIPWIPWIPWIPWIP(Procedure)IC•CircuitProbingCP(a)-5-CircuitProbe1CP1CircuitProbe2CP2CP22CP•ICICPackaging(b)ICWaferSawLeadFrameSubstrateDieBondingWireBondingMolding(Marking)Trim/FromIC26ICMIL-STD105DieBonding•IC(c)(DRAM)FT1FinalTest1FT2FinalTest2FT3FinalTest3FT1FunctionalTestDirect-6-CurrentTestFT2FT1FT2FT3FT1FT2Burn-InIC25FT1FT2FT3BIN8BIN16BINBINICBINAFT2BIN1BIN3BIN4~BIN8BIN2BBIN2BIN4~BIN6BINFTRe-BurnInIQCOQCEQCFTBINBINDieBondBINWIPWIP-7-()WIPTOP-DOWN(1)WIPPackageTypeDeviceNoCycleTime-8-IC(2)OperationOPWIPOPDieBondProxyCuring(3)IDEFBIN(4)-9-WIP(5)HoldWIP(6)WIPWIPWIP(7)-10-WIPERPSCMMESManufacturingExecutionSystemSPC3(8)Report(9)WIPWIPWIPCustomizationWP-11-WIPWIPWIPWIPDocumentationUMLUnifiedModelingLanguage8-12-[1]19981998[2]IC1998189189-203[3]MIRL-MES1998189181-188[4]IC/WIP1997172161-170[5]199654-59[6]IC1995187-194[7]R.Uzsoy,C.Y.LeeandL.A.Martin-Vega,“AReviewofProductionPlanningandSchedulingModelsinSemiconductorIndustry.Part1SystemCharacteristics,PerformanceEvaluationandProductionPlanning”,IIETransactions,1992,Vol.24,No.4,47-60.[8]G.Booch,J.Rumbauge,I.Jacobson,TheUnifiedModelingLanguage,AddisionWesley,1999.:MES:MES