电镀废水监测

()1,2,3(1.,300100;2.,300191;3.,100037):TQ153:A:100024742(2008)01200402032,GB897821996,,1.0mg/L,:,,,;,,2.1,1mg/L(Pb)=1mg/L,C(Pb)=110-3/207.2=4.8310-6(mol/L),,1.010-71.010-4mol/L,,8.010-8mol/L,,(30%PbS270%Ag2S),pH46Ag+Cu2+Hg2+Fe3+S2-I-Cu2+Fe3+Al3+Zn2+Ca2+Mg2+:10-6mol/L,Fe3+Al3+20100Pb2+;0.1mol/LKNO3,pH5.30HAc2NaAcpH,10g/L3.5mL,10-4mol/LFe3+10-4mol/LAl3+10-6mol/LS2-I-,,E1,Vs(V1/100)s(x100),,E2,:E=E2-E1,x,,,,E8mV,0.2mV,4%,,,2.2,,305(),232C()(AR),NaOH1mol/L,1g/L,pH:1mol/LHAc2NaAc,pH5.30;TISAB()0.1mol/LKNO3,0.1000mol/LPb(NO3)2;2:2g/L1g/L2.3s250mL,25mL10-5mol/L10-6mol/LPb2+;pH5.301mol/LHAc2NaAc5mL1%04Jan.2008Electroplating&PollutionControlVol.28No.13.5mL,0.1mol/LKNO3100mL,,,E1E2s=E=E2-E12.4(1)100mL250mL,15mL,,,100mL,22,1mol/LNaOH,,pH5.3010mL,,(2)520mL(,1050g),50mL,pH5.301mol/LHAc-NaAc5mL1%3.5mL,0.1mol/LKNO3100mL,,,E11.0mL10-6mol/LPb2+,E22.5,x:x=sVsVx(10Es-1)-1:sPb2+,mg/L;Ex,mV;EsPb2+,mV;E(E2-E1),mV;VsPb2+,mL;Vx,mL;s3,,GB897821996,,1.0mg/L,:,,pH2,1%,3.1,,14440nm530nm,1.51046.6103L/(molcm),530nm,,,Na22EDTA50gNi2+,500g/L2mL,:Pb2+Zn2+Ca2+Mg2+Cr6+5mg,Al3+3mg,Hg2+1mg,Pd2+Ag+Cr3+50g;50g/LNa22EDTA2mL,Fe3+3mg,Co2+1mg,Cu2+Mn2+0.5mg,2,,3.2,1cm,,2mol/L,500g/L;0.05mol/L:12.7g,25g,,1000mL;Na22EDTA50g/L;5g/L:0.5g50mL,100mL;:100g/mL,(99.9%)0.1000g10mL(1+1),,(1+99),1000mL;(A):10.0g/mL,10.0mL100mL,2mL(1+1),;(B):20.0g/mL,20.00mL100mL,2mL(1+1),3.3(1)825mL,(A)(10.0g/mL):01.002.003.004.005.006.007.00mL,500g/L2mL,0.05mol/L1.0mL,20mL,5g/L2.0mL,50g/LNa22EDTA2.0mL,,5min,440nm,1cm1420081281(159),,,g,,A=0.0154,g/50mL,r=0.9992(440nm,1cm)(2)925mL,(B)(20.0g/mL):01.002.003.004.005.006.007.008.00mL,500g/L2mL,0.05mol/L1.0mL,20mL,;5g/L2.0mL,;50g/LNa22EDTA2.0mL,,5min,530nm,1cm,,,g,3(530nm,1cm)3.4(1)110mL(10100g),25mL,2mol/L,3.3(1),530nm3.3(2)(2),,3.5:=m/V:,mg/L;V,mL;m,g3.6(1),20mL,,,,,,(2),,Na22EDTA,(3)20,1h,,,(15min),530nm,,(4)2:(50g)100mL,10g/L2mL,;1g/L,(1+1),pH10.021mL,30mL,10mL12min,,0.5mol/L[(1+26)]5mL,30s,1,0.5mol/L[(1+23)]5mL,12min,25mL,5mL1,1mol/L1.5mL,200g/L0.5mL,0.05mol/L1.0mL,20mL,;5g/L2.0mL,;50g/LNa22EDTA2.0mL,,440nm,1cm,,,():200720622524Jan.2008Electroplating&PollutionControlVol.28No.1