KLMxGxWEBC-B031(eMMC5.0-1xnm-e-MMC)1.0-32GB64GB-TL

-1-SAMSUNGELECTRONICSRESERVESTHERIGHTTOCHANGEPRODUCTS,INFORMATIONANDSPECIFICATIONSWITHOUTNOTICE.Productsandspecificationsdiscussedhereinareforreferencepurposesonly.AllinformationdiscussedhereinisprovidedonanASISbasis,withoutwarrantiesofanykind.ThisdocumentandallinformationdiscussedhereinremainthesoleandexclusivepropertyofSamsungElectronics.Nolicenseofanypatent,copyright,maskwork,trademarkoranyotherintellectualpropertyrightisgrantedbyonepartytotheotherpartyunderthisdocument,byimplication,estoppelorother-wise.Samsungproductsarenotintendedforuseinlifesupport,criticalcare,medical,safetyequipment,orsimilarapplicationswhereproductfailurecouldresultinlossoflifeorpersonalorphysicalharm,oranymilitaryordefenseapplication,oranygovernmentalprocurementtowhichspecialtermsorprovisionsmayapply.ForupdatesoradditionalinformationaboutSamsungproducts,contactyournearestSamsungoffice.Allbrandnames,trademarksandregisteredtrademarksbelongtotheirrespectiveowners.ⓒ2013SamsungElectronicsCo.,Ltd.Allrightsreserved.Rev.1.0Sep.2013SAMSUNGCONFIDENTIALKLMxGxWEBC-B031Samsunge·MMCProductfamilye.MMC5.0Specificationcompatibilitydatasheet-2-IFTHEREISANYOTHEROPERATIONTOIMPLEMENTINADDITIONTOSPECIFICATIONINTHEDATASHEETORJEDECSTANDARD,PLEASECONTACTEACHBRANCHOFFICEORHEADQUARTERSOFSAMSUNGELECTRONICS.datasheete·MMCRev.1.0KLMxGxWEBC-B031SAMSUNGCONFIDENTIALRevisionHistoryRevisionNo.HistoryDraftDateRemarkEditor0.01.InitialissueJul.22,2013TargetS.M.Lee0.51.EngineeringSample2.SleepCurrentisChanged.(120-150uA[@25C],400-450uA[@85C])Aug.19,2013PreliminaryS.M.Lee1.01.32GBisCustomerSample2.DefaultsizeofRPMBischangedto4,096KBinTable103.PerformanceischangedinTable154.ActivepowerofcontrollerischangedinChapter8.1.Sep.10,2013FinalS.M.Lee-3-IFTHEREISANYOTHEROPERATIONTOIMPLEMENTINADDITIONTOSPECIFICATIONINTHEDATASHEETORJEDECSTANDARD,PLEASECONTACTEACHBRANCHOFFICEORHEADQUARTERSOFSAMSUNGELECTRONICS.datasheete·MMCRev.1.0KLMxGxWEBC-B031SAMSUNGCONFIDENTIALRevisionHistoryAppendix(0.5)RevisionHistoryAppendix(1.0)Before(ver.0.0)After(ver.0.5)Before(ver.0.5)After(ver.1.0)TableOfContents-4-IFTHEREISANYOTHEROPERATIONTOIMPLEMENTINADDITIONTOSPECIFICATIONINTHEDATASHEETORJEDECSTANDARD,PLEASECONTACTEACHBRANCHOFFICEORHEADQUARTERSOFSAMSUNGELECTRONICS.datasheete·MMCRev.1.0KLMxGxWEBC-B031SAMSUNGCONFIDENTIAL1.0PRODUCTLIST..........................................................................................................................................................52.0KEYFEATURES.........................................................................................................................................................53.0PACKAGECONFIGURATIONS.................................................................................................................................63.1153BallPinConfiguration.......................................................................................................................................63.1.111.5mmx13mmx1.0mmPackageDimension................................................................................................73.2ProductArchitecture................................................................................................................................................84.0e.MMC5.0feature......................................................................................................................................................94.1HS400mode............................................................................................................................................................95.0TechnicalNotes..........................................................................................................................................................115.1S/WAgorithm..........................................................................................................................................................115.1.1PartitionManagement.......................................................................................................................................115.1.1.1BootAreaPartitionandRPMBAreaPartition............................................................................................115.1.1.2EnhancedPartition(Area)..........................................................................................................................115.1.2Bootoperation...................................................................................................................................................125.1.3UserDensity......................................................................................................................................................135.1.4AutoPowerSavingMode..................................................................................................................................135.1.5Performance..........................................................................................................................................